News TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks

[Admin]

TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.

TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks : Read more

 

[jp7189]

This is timely and should help dull the pain of high na euv's smaller reticle size.

 

[Kamen Rider Blade]

This should offer interesting Super Sized Chips for High End Computing.

 

[usertests]

Next up, TSMC promises 5.5-reticle size packages with up to 12 HBM4 memory stacks in 2025 – 2026. However, this pales behind the company's ultimate version of CoWoS, enabling system-in-packages (SiPs) of up to nine reticle sizes with 12 and potentially more HBM4 modules onboard.

We are at around 48 GB per HBM4 stack now, with 64 GB incoming. So that would be 576-768 GB (or greater if more than 12 stacks), compared to 288 GB for the MI355X.

https://videocardz.com/pixel/sk-hyn...-memory-with-16-stacks-up-to-48gb-of-capacity

We Can’t Get Enough HBM, Or Stack It Up High Enough

There are lots of ways that we might build out the memory capacity and memory bandwidth of compute engines to drive AI and HPC workloads better than we

www.nextplatform.com