TSMC deploys AMD EPYC platforms for mission-critical fab tool controls.
TSMC Uses AMD's EPYC Chips to Make Chips : Read more
TSMC Uses AMD's EPYC Chips to Make Chips : Read more
There is nothing weird about having a circular manufacturing chain where stuff you make ultimately gets used to help you make more better stuff. Workshops often need to make custom tools for a job or even make the custom tools needed to make custom tools for a job. For robots and multi-axes machining, high-precision machines get gilded and used to make higher-precision parts in order to make even higher precision machines possiblem, rinse and repeat until you have reached the desired level of precision or the practical limits within a given budget.
Practically all industries where the machines can be used to improve themselves in some way have a circular element to it.
It likely happens 24/7, just not with parts people can be bothered to know about. Each ASML machine probably has 100+ micro-controllers, SoCs, DSPs, FPGAs, CPLDs, etc. made in TSMC fabs and many more made elsewhere. Everyone has dependencies with everybody else.I suppose what makes this a little different is the fact that these are not custom tools. It just so happens that the product TSMC manufactures for a customer is a good fit for their needs. I suspect that doesn't happen all that often.
It likely happens 24/7, just not with parts people can be bothered to know about. Each ASML machine probably has 100+ micro-controllers, SoCs, DSPs, FPGAs, CPLDs, etc. made in TSMC fabs and many more made elsewhere. Everyone has dependencies with everybody else.
If you think 100 processors of some sort is a lot for a 100 tons wafer-processing machine that is in charge of managing wafer exposure at sub-nanometer precision, keep in mind that modern cars where nearly everything is controlled by wire to some extent can have 200+.
Who said there is a problem?I don't see problem here, as long as they paid for it 😁
Who said there is a problem?
For all you know, the entire office where the person who designed the turn signal, the injection molding machine used to manufacture it, the plastic refinement process used to produce the raw pellets used for injection, etc. could have been furnished exclusively with Ikea stuff.What you are referring to is specific to TSMC. I'm simply saying that most manufacturing companies probably don't use their clients' products all that often. As in... whomever makes that plastic chair for IKEA, or whomever makes the turn signal switch in your car.
The last-ship date for new Itanium CPUs is scheduled for July 29th 2021, so it shouldn't be too hard to find replacement CPUs for a while longer.What does surprise me in all this, Itanium is still used for mission critical stuff. Aren't spare parts for those things getting rather rare by now?
For all you know, the entire office where the person who designed the turn signal, the injection molding machine used to manufacture it, the plastic refinement process used to produce the raw pellets used for injection, etc. could have been furnished exclusively with Ikea stuff.
That is total nonsense. Spectre is of virtually no concern to a company like TSMC, especially for Manufacturing Control Systems (MCS) because they are virtually never connected externally. Your second paragraph is especially lacking in any facts. No chips are reprogrammed for a different set of lithography masks or feature sizes and layers and Vias are NOT cut from silicon. It's all done by the (EUV) light exposing wafers through masks. The light strikes photoresistive material on the wafer and it is removed where there is exposure to the light. That is how all features on chips are made. All ionic doping and implantation, diffusion, etching, and deposition is done to areas of the wafer where the photoresistive material has been exposed and removed by the light.I do find this a bit odd, and I am not going to say why, because for most it would envelop the type of theories that Ed Snowdon comes out with. The AMD chip is particularly vulnerable to Spectre, and this is not usual practice for a CISC chip to be used in this way, Primarily for the reasons of Security.
Risc architectures or even more preferable, would use PICs and their Ilk, because the processes run are Highly linear and, rather than have one Complex chip do everything even to controling the robots, you have lots of smaller chips being slaved, so that the smaller chips cannot do naferious things (after being hacked) and produce usual products using usual subroutines. Part of the Modification process and the 6 month cycle to get a Fab plant to produce new Lithography sizes, is to reprogram all the chips (useing internal writing to the RAM of PIC's etc) that are required for the printing of the new sizes, and changing the gear systems to produce smaller and more precise movements when cutting layers and placing VIAs.
It is all time consuming, but adds a layer of security that makes hacking etc near impossible (unless you know the hardware intimately), and the process very refined and controlled making use of Mechatronics to the most advanced level, without giving one person the keys to the kingdom remotely.
This method would be more efficient, but if the system is connected online, expect TSMC to get attacked sooner or later.
The fact is, this could have been done before with Intel chips, they question is why?
That is t
That is total nonsense. Spectre is of virtually no concern to a company like TSMC, especially for Manufacturing Control Systems (MCS) because they are virtually never connected externally. Your second paragraph is especially lacking in any facts. No chips are reprogrammed for a different set of lithography masks or feature sizes and layers and Vias are NOT cut from silicon. It's all done by the (EUV) light exposing wafers through masks. The light strikes photoresistive material on the wafer and it is removed where there is exposure to the light. That is how all features on chips are made. All ionic doping and implantation, diffusion, etching, and deposition is done to areas of the wafer where the photoresistive material has been exposed and removed by the light.