News UCIe 2.0 specifications standardize management architecture and 3D packaging across different chiplets

[Admin]

UCIe specification reaches version 2.0, gets interoperability architecture for multi-vendor chiplets and 3D packaging support optimized for hybrid bonding and bump pitches.

UCIe 2.0 specifications standardize management architecture and 3D packaging across different chiplets : Read more

 

[bit_user]

The UCIe 2.0 specification introduces a standardized manageability system architecture that addresses manageability, testability, and debugging (Dfx) across multiple chiplets throughout the SiP lifecycle. In addition, the new spec defines optional UCIe DFx Architecture (UDA), which integrates vendor-agnostic testing, telemetry, and debug fabric within each chiplet to simplify development and bring-up of multi-chip system-on-packages.

Cool stuff, but I hope the design and implementations are very thoughtful about security. If not, I shudder to think what a wealth of new attack vectors this could potentially introduce.