News Unreleased Intel CPU with LGA1851 Socket Caught on Camera

[Admin]

Intel's next-generation CPUs to feature a different integrated heat spreader.

Unreleased Intel CPU with LGA1851 Socket Caught on Camera : Read more

 

[bit_user]

the processor still gives an idea how Intel's LGA1851 CPUs will look like when they come to market in 2024 in the form of Intel's Arrow Lake products.

Something you guys should ask Intel, at their upcoming press events: How long will that platform last? Is it going to be one-and-done, since LGA1700 got extended for another year?

I can imagine Intel might want to start dabbling with in-package memory, and that's probably going to require changes in package dimensions. If they were going to do that in 2025, I doubt they'll delay for a year, just to placate partners and motherboard makers.

SK Hynix Launches 24GB LPDDR5X-8500 Stacks for Smartphones, PCs, and HPC

www.anandtech.com

 

[InvalidError]

Something you guys should ask Intel, at their upcoming press events: How long will that platform last? Is it going to be one-and-done, since LGA1700 got extended for another year?

Likely to be two generations as usual, which would likely be 14th and 15th.

I can imagine Intel might want to start dabbling with in-package memory, and that's probably going to require changes in package dimensions.

Unless they stack it on the SoC tile, then it requires zero added substrate space. If Intel is going to do full 3D packaging, there is no reason not to start with stacking memory on SoC first, one of few 3D-stacking things that can be done without worrying much about power density.

 

[bit_user]

Unless they stack it on the SoC tile, then it requires zero added substrate space.

Will that have enough area for two stacks? According to the article I linked, each stack has a 64-bit interface.

 

[InvalidError]

Will that have enough area for two stacks? According to the article I linked, each stack has a 64-bit interface.

16Gbits DRAM dies are only about 90sqmm, stack then 8-high and you have 16GB that you can slap onto just about anything. Interface-wise, if you are going to stack DRAM onto an SoC die, the interface can be whatever gets agreed to.

 

[PEnns]

Yay, a new motherboard requirement from Intel!!

I doubt TH reviewers will see this as a major negative as much as they did with AMD, in EVERY review!!!!!

Don't hold your breath.

 

[The Historical Fidelity]

Yay, a new motherboard requirement from Intel!!

I doubt TH reviewers will see this as a major negative as much as they did with AMD, in EVERY review!!!!!

Don't hold your breath.

Yeah,

AMD:
“New motherboard socket after being able to use previous am4 mobo’s for 4 CPU generations = negative & expensive”
“only comes in DDR5 flavor = negative & expensive” even though they know AMD designed am5 for another 4 cpu generations and DDR4 support would be useless after the first gen and make the socket more expensive.
“can re-use am4 coolers on am5 CPU’s = nothing to see here folks!”

Intel:
New motherboard every 2 generations is A-OK!!!
LGA1700 motherboards come with both DDR4 & 5 support is better than AM5’s DDR5 only support.
And I speculate reviewers will now say “LGA1851 DDR5 only support is a POSITIVE because DDR4 is old tech and DDR5 is higher performance!”

Typical Intel fueled bias incoming.

 

[InvalidError]

Yeah,

AMD:
“New motherboard socket after being able to use previous am4 mobo’s for 4 CPU generations = negative & expensive”

The worst part with AMD's new platforms is that AMD needs about a year to work quite substantial bugs out. It is also fair to take issue with how AM5 being DDR5-only means ~$100 more expensive entry-level cost vs Intel's.

Intel:
New motherboard every 2 generations is A-OK!!!

For most sane people, it is perfectly fine. In the grand scheme of things, most home and office PCs will not see an upgrade within their lifetime with their original owner, maybe only at recyclers trying to maximize the value they can extract from the parts they get. For the general population, I bet less than 5% of PCs ever get "first life" upgrades. About 75% of PC sales are laptops where most stuff is soldered on the motherboard and upgrades are practically impossible to begin with.

 

[bit_user]

The worst part with AMD's new platforms is that AMD needs about a year to work quite substantial bugs out. It is also fair to take issue with how AM5 being DDR5-only means ~$100 more expensive entry-level cost vs Intel's.

Yes, it's fair to point that out. However, Ryzen 5000/AM4 also has been a viable option for entry-level, and saw good discounts after the launch of 7000/AM5, and that also should be given consideration. So, in a real sense, AMD did retain a DDR4 entry-level platform.

Earlier this year, I just bought an AM4 board + CPU + DDR4 RAM.

 

[The Historical Fidelity]

The worst part with AMD's new platforms is that AMD needs about a year to work quite substantial bugs out. It is also fair to take issue with how AM5 being DDR5-only means ~$100 more expensive entry-level cost vs Intel's.


For most sane people, it is perfectly fine. In the grand scheme of things, most home and office PCs will not see an upgrade within their lifetime with their original owner, maybe only at recyclers trying to maximize the value they can extract from the parts they get. For the general population, I bet less than 5% of PCs ever get "first life" upgrades. About 75% of PC sales are laptops where most stuff is soldered on the motherboard and upgrades are practically impossible to begin with.

Okay so you agree that LGA1851 being DDR5 only = negative & expensive

 

[Lucky_SLS]

"Meanwhile, LGA1851 will increase the height of IHS from 6.73-7.4 mm to 6.83-7.49 mm"

Shouldnt this be from 6.73 - 6.83 to 7.4 -7.49 mm?

otherwise, those tolerance dont look so good...

 

[The Historical Fidelity]

"Meanwhile, LGA1851 will increase the height of IHS from 6.73-7.4 mm to 6.83-7.49 mm"

Shouldnt this be from 6.73 - 6.83 to 7.4 -7.49 mm?

otherwise, those tolerance dont look so good...

Non-sense!

Reviewers: “Intel’s new 3D heat spreader Topology is much better than AMD’s uniform heat spreader topology. Five stars!” Lol

 

[ilukey77]

Something you guys should ask Intel, at their upcoming press events: How long will that platform last? Is it going to be one-and-done, since LGA1700 got extended for another year?

I can imagine Intel might want to start dabbling with in-package memory, and that's probably going to require changes in package dimensions. If they were going to do that in 2025, I doubt they'll delay for a year, just to placate partners and motherboard makers.

​

SK Hynix Launches 24GB LPDDR5X-8500 Stacks for Smartphones, PCs, and HPC

www.anandtech.com

​

Im actually hoping Intel pull their finger out their arse and increase socket life ..
It would go a long way to dragging back consumers to their brand !!

I would certainly look at Intel over AMD if they offered 3d v cache and a longer socket life !!

 

[TerryLaze]

Im actually hoping Intel pull their finger out their arse and increase socket life ..
It would go a long way to dragging back consumers to their brand !!

I would certainly look at Intel over AMD if they offered 3d v cache and a longer socket life !!

Dragging them back from where?
They are 80 to 20 which is a pretty normal ratio for the last 20 years, it does fluctuate up and down over time but 80-20 is pretty much the normal state.

Intel Saw A 23% Client CPU Market Share Increase In Q2 2023 While AMD Fell -5.3%

The Client CPU market seems to have broken its downward trend with Intel leading the charge over AMD, reports Jon Peddie Research.

wccftech.com