News US to boost chip packaging capacity with CHIPS Act grant — Amkor to receive $600 million for advanced chip packaging facility

[Admin]

Amkor gets $600 in grants and loans to build an advanced packaging facility in Arizona that will support TSMC's fab in the state.

US to boost chip packaging capacity with CHIPS Act grant — Amkor to receive $600 million for advanced chip packaging facility : Read more

 

[ezst036]

Beautiful, wonderful lobbyists. It's just great.

 

[thisisaname]

If your going to fab the chips there should be somewhere to package them too.