TerryLaze
Polypheme
The x3d chips lack security features that prevent them from burning up, that's a conscious decision to leave them out (or the only way they could do it) .All companies have blind spots in their QA process. With so much stuff controlled by firmware and software, catastrophic failure is always one bad update away regardless of who you buy stuff from. AMD may have just had its first major such failure, Intel could be next.
Intel having consistently fewer weird quirks is likely due to having a more extensive regression test suite to run against its CPUs and chipsets.
It's not QA or an oversight.
Yes, being a few degrees hotter than what users would like is the same as the CPU blowing up...."...Due to the elongated shape of LGA 1700 CPUs, and how they are secured in the socket, the CPUs have been known to bend or warp while installed in the motherboard’s socket. This can cause higher temperatures due to uneven contact with CPU coolers.
There are a few solutions available for enthusiasts who wish to fix this issue in pursuit of lower CPU temperatures, but they all involve potentially warranty breaking modifications. ..."
https://www.tomshardware.com/reviews/thermalright-lga1700-bcf-contact-frame
Yeah, marvelous, encountering a cooling issue out of the box, and then being faced with void warranty when one wants to fix that...