[SOLVED] What do you make of my temps after 7700K delid?

[emitfudd]

My cpu used to run around 154 F all the time. My build is about 2 years old now. It recently starting showing max temps according to Afterburner of 176 F. I decided to delid with Rockit 88 kit. I applied Conductonaut to the die and IHS. I applied Kryonaut between the IHS and Thermaltake water 3.0 Ultimate. I was using a Hyper 212 evo prior to the delid. I was expecting the usual 10 to 20 C drop in temps. My temps actually increased. I have verified the pump on the AIO is running at full speed and the 3 fans are spinning at 50% minimum up to 100% under stress test. I have been running the cpu at a constant 4.5Ghz at 1.20 volts. Testing with OCCT immediately jumped up to the default test shut off of 185 F. Prior to delid I was getting temps around 180 F with OCCT. I have noticed that core 2 reports a temp of approximately 20 to 25 degrees hotter than the other 3. AIDA 64 reports that core 1 is running 20 to 25 degrees hotter. I have a Corsair 780T with 2 140mm intake fans in the front, a 140mm exhaust fan in the rear and the AIO is exhausting through the top of the case with 3 120mm fans. My GPU temp actually decreased since the addition of the AIO so case airflow is not a problem. I was meticulous about the application of Conductonaut and I removed all the old adhesive. I used a drop of Loctite super glue on the OUTSIDE of the 4 corners just to hold everything in place.

I lowered my vcore voltage all the way down to 1.110 and that helped with the temps enough to run OCCT but it still peaks at up to 183 F. I played Farcry 5 for a few hours and the average temps were around 140 F to 150 F which is about what is was before delid. The max temp recorded by Afterburner was 167 F. Prior to delid I was getting a max temp by Afterburner of 176 F. So I now have a 9 degree F lower temp but had to lower the vcore from 1.20 to 1.110. Running most any stress test at a vcore of 1.20 was resulting in temps of around 200 F.

How can i possibly be getting higher temps after delid along with huge difference on just one core?

I7 7700K
Asus Maximus Code IX
Gigabyte 1080 Ti
Seasonic 850 watt PSU
Samsung 960 EVO M.2 SSD x2
Corsiar Vengeance RAM 32Gb 3000Mhz
Thermaltake Water 3.0 Ultimate 360mm
Corsiar 780T case

 

[bmacsys]

My cpu used to run around 154 F all the time. My build is about 2 years old now. It recently starting showing max temps according to Afterburner of 176 F. I decided to delid with Rockit 88 kit. I applied Conductonaut to the die and IHS. I applied Kryonaut between the IHS and Thermaltake water 3.0 Ultimate. I was using a Hyper 212 evo prior to the delid. I was expecting the usual 10 to 20 C drop in temps. My temps actually increased. I have verified the pump on the AIO is running at full speed and the 3 fans are spinning at 50% minimum up to 100% under stress test. I have been running the cpu at a constant 4.5Ghz at 1.20 volts. Testing with OCCT immediately jumped up to the default test shut off of 185 F. Prior to delid I was getting temps around 180 F with OCCT. I have noticed that core 2 reports a temp of approximately 20 to 25 degrees hotter than the other 3. AIDA 64 reports that core 1 is running 20 to 25 degrees hotter. I have a Corsair 780T with 2 140mm intake fans in the front, a 140mm exhaust fan in the rear and the AIO is exhausting through the top of the case with 3 120mm fans. My GPU temp actually decreased since the addition of the AIO so case airflow is not a problem. I was meticulous about the application of Conductonaut and I removed all the old adhesive. I used a drop of Loctite super glue on the OUTSIDE of the 4 corners just to hold everything in place.

I lowered my vcore voltage all the way down to 1.110 and that helped with the temps enough to run OCCT but it still peaks at up to 183 F. I played Farcry 5 for a few hours and the average temps were around 140 F to 150 F which is about what is was before delid. The max temp recorded by Afterburner was 167 F. Prior to delid I was getting a max temp by Afterburner of 176 F. So I now have a 9 degree F lower temp but had to lower the vcore from 1.20 to 1.110. Running most any stress test at a vcore of 1.20 was resulting in temps of around 200 F.

How can i possibly be getting higher temps after delid along with huge difference on just one core?

I7 7700K
Asus Maximus Code IX
Gigabyte 1080 Ti
Seasonic 850 watt PSU
Samsung 960 EVO M.2 SSD x2
Corsiar Vengeance RAM 32Gb 3000Mhz
Thermaltake Water 3.0 Ultimate 360mm
Corsiar 780T case

Be a good question for der8auer. I think you must have some sort of contact issue.

 

[compprob237]

My cpu used to run around 154 F all the time. My build is about 2 years old now. It recently starting showing max temps according to Afterburner of 176 F.

I decided to delid with Rockit 88 kit. I applied Conductonaut to the die and IHS. I applied Kryonaut between the IHS and Thermaltake water 3.0 Ultimate. I was using a Hyper 212 evo prior to the delid.
I was expecting the usual 10 to 20 C drop in temps. My temps actually increased. I have verified the pump on the AIO is running at full speed and the 3 fans are spinning at 50% minimum up to 100% under stress test. I have been running the cpu at a constant 4.5Ghz at 1.20 volts.
Testing with OCCT immediately jumped up to the default test shut off of 185 F.
Prior to delid I was getting temps around 180 F with OCCT. I have noticed that core 2 reports a temp of approximately 20 to 25 degrees hotter than the other 3. AIDA 64 reports that core 1 is running 20 to 25 degrees hotter. I have a Corsair 780T with 2 140mm intake fans in the front, a 140mm exhaust fan in the rear and the AIO is exhausting through the top of the case with 3 120mm fans. My GPU temp actually decreased since the addition of the AIO so case airflow is not a problem. I was meticulous about the application of Conductonaut and I removed all the old adhesive. I used a drop of Loctite super glue on the OUTSIDE of the 4 corners just to hold everything in place.

I lowered my vcore voltage all the way down to 1.110 and that helped with the temps enough to run OCCT but it still peaks at up to 183 F. I played Farcry 5 for a few hours and the average temps were around 140 F to 150 F which is about what is was before delid. The max temp recorded by Afterburner was 167 F. Prior to delid I was getting a max temp by Afterburner of 176 F. So I now have a 9 degree F lower temp but had to lower the vcore from 1.20 to 1.110. Running most any stress test at a vcore of 1.20 was resulting in temps of around 200 F.

How can i possibly be getting higher temps after delid along with huge difference on just one core?

I7 7700K
Asus Maximus Code IX
Gigabyte 1080 Ti
Seasonic 850 watt PSU
Samsung 960 EVO M.2 SSD x2
Corsiar Vengeance RAM 32Gb 3000Mhz
Thermaltake Water 3.0 Ultimate 360mm
Corsair 780T case

It sounds like there's something wrong with the delid. When you have one core vastly hotter than another then that usually means something's not right.
The area around where Core1 resides must have an air bubble or is not contacting the IHS. There's possibly just too much space between the IHS and CPU die as well.

Are you using the copper IHS that comes with one of rockit's delid kits? I'd suggest trying with the original IHS if so. There's a chance yours has a manufacturing defect (slim chance but possible).
Take a look at this video to see how it should (roughly) be done:

View: https://youtu.be/kYnUfXl0Gdw?t=352

Time stamp start: ~5:52
This shows the delid, cleaning, adhesive removal, warnings about TIM application (even spreading, not too much/little), Conductonaut application (both location and amount), how to protect the internal capacitors/resistors (nail polish), ~11:30 liquid metal/conductonaut specific - how much to apply (Way less than you think), how to siphon the liquid metal to recover excess, make sure no cotton fuzz is left behind if you used a cotton q-tip, ~13:00 example of too much liquid metal ("pool" of it/ripples), and warnings about boot/temp issues (spillover). The only thing not covered here is gluing the IHS back down. Superglue is perfect for that just make sure you use as little as possible. You're aiming for just enough so that the IHS is held in place and no more. My personal suggestion is to use silicone adhesive (VERY little, darn near just a smear) in each corner of the IHS. Make sure that you remove the original adhesive from the IHS and substrate and, before the adhesive is dry, install the CPU with its cooler and clamp it down. The goal here is to squeeze that silicone adhesive as thin as possible before it is dry. This makes the layer of liquid metal as thin as possible which improves performance.

Rockit's delid tool accomplishes the same if you use the relid assembly. Just apply the adhesive, put the CPU into the tool, and clamp it down with the relid assembly. If you use Silicone adhesive it will take an hour or so (sometimes up to 4, depends) to soft-cure. Most silicone adhesives take 24 hours to fully cure.

Here's another video if you want a more verbose explanation as well as resealing techniques:

View: https://www.youtube.com/watch?v=w9i_ULemBhI

 

[emitfudd]

Thanks for all the information on the delid/relid process. I watched every video and read every article I could find before I even ordered the delid kit. I feel confident that I did it exactly right. I removed all of the old adhesive. The first application of Conductonaut was too much so I wiped it off and did it again. The super glue was only applied to the outside edges of the IHS once it was placed in the relid tool. Then I clamped it down with the thumb screw and let it sit for 24 hours. The die should be making perfect contact with the IHS since there is no glue or adhesive under the IHS.

I suspect the Kryonaut under the water block might be the issue. I initially used the spread method. I then had to remove the water block so I could reseat the cpu (couldn't post after putting everything back together). The second time I cleaned off all the Kryonaut and used the pea method. Thermal Grizzly says to use the spread method. Perhaps the pea method didn't allow it to spread properly under the water block.

I am using the original IHS. I also applied Conductonaut to both the die and the underside of the IHS. I made a template out of tape so the LM under the IHS should match the die exactly. I did use clear nail polish on the 4 little contacts right beside the die. I made sure the nail polish only covered as close to the contacts as possible so that the IHS wouldn't be sitting "on top" of the nail polish and make an uneven surface.

 

[compprob237]

Thanks for all the information on the delid/relid process. I watched every video and read every article I could find before I even ordered the delid kit. I feel confident that I did it exactly right. I removed all of the old adhesive. The first application of Conductonaut was too much so I wiped it off and did it again. The super glue was only applied to the outside edges of the IHS once it was placed in the relid tool. Then I clamped it down with the thumb screw and let it sit for 24 hours. The die should be making perfect contact with the IHS since there is no glue or adhesive under the IHS.

I suspect the Kryonaut under the water block might be the issue. I initially used the spread method. I then had to remove the water block so I could reseat the cpu (couldn't post after putting everything back together). The second time I cleaned off all the Kryonaut and used the pea method. Thermal Grizzly says to use the spread method. Perhaps the pea method didn't allow it to spread properly under the water block.

I am using the original IHS. I also applied Conductonaut to both the die and the underside of the IHS. I made a template out of tape so the LM under the IHS should match the die exactly. I did use clear nail polish on the 4 little contacts right beside the die. I made sure the nail polish only covered as close to the contacts as possible so that the IHS wouldn't be sitting "on top" of the nail polish and make an uneven surface.

If you have one core that is significantly hotter than others then it is a problem with the liquid metal. You may have a piece of cotton or the old adhesive stuck in the liquid metal that is causing the issue. The only time you'd have significant temperature difference (outside of intel's +/-15°C spec) is when the core that is hot is failing or the thermal paste/liquid metal has an application problem (like debris, air bubbles, or has degraded).

 

[emitfudd]

I used the black qtips that come with the Conductonaut and am sure there was no contamination in there. Is it possible for one core to fail on a chip like this? My temps started to increase over the past few months before the delid. I was consistently at 67C while gaming and then it started going up to 73C and then got to the point where it was 80C. Would that also indicate a core failing. Now I am mad that I delidded because I would have been in the warranty period for the cpu still.

I guess I have no choice but to try to delid again just in case and if nothing improves I have to bite the bullet and replace the cpu.

 

[emitfudd]

If you have one core that is significantly hotter than others then it is a problem with the liquid metal. You may have a piece of cotton or the old adhesive stuck in the liquid metal that is causing the issue. The only time you'd have significant temperature difference (outside of intel's +/-15°C spec) is when the core that is hot is failing or the thermal paste/liquid metal has an application problem (like debris, air bubbles, or has degraded).

I took everything apart today. The Kryonaut under the water block did spread completely. When I delidded the cpu again there was just a faint trace of Conductonaut. I swiped my finger across it and nothing came off on my finger. It's like it evaporated or something. I cleaned everything and reapplied Conductonaut exactly the same amount as I did before. I did notice some debris in the LM as I was spreading it. I think it was from the black Qtips. I thought they weren't supposed to do that. I kept going over it until there were no visible traces of contamination. I put the water block on with no thermal paste just to make sure it would boot up ok. I was shocked that not only was it running fairly cool with no thermal paste but the individual cores were all within 2 to 3C.

As you stated there must have been some contamination in my first application.

I ordered another tube of Kryonaut the other day and when it arrives I will apply that under the water block. Yes I did shut down the computer until the Kryonaut arrrives. I will be anxious to see what kind of temps I get. Thanks for convincing me to redo the delid/relid.

One more thing to add. The first time around I let the cpu sit in the Rockit 88 relid tool for 24 hrs while the loctite super glue at the four corners dried. There was no information on how tight to make the thumbsrew so I tightened it moderately finger tight. This time I let it sit in the relid tool for about an hour until the loctite was tacky enough to hold the IHS in place and then installed in the socket and let the clamp do the work. I wonder if it is possible since the thumbscrew puts pressure in the center of the IHS and the socket clamp puts pressure on the side edges of the IHS if the loctite dried in a position that didn't match up properly to the socket clamp pressure. Maybe this caused the IHS to pull away from the die slightly?

 

[compprob237]

One more thing to add. The first time around I let the cpu sit in the Rockit 88 relid tool for 24 hrs while the loctite super glue at the four corners dried. There was no information on how tight to make the thumbsrew so I tightened it moderately finger tight. This time I let it sit in the relid tool for about an hour until the loctite was tacky enough to hold the IHS in place and then installed in the socket and let the clamp do the work. I wonder if it is possible since the thumbscrew puts pressure in the center of the IHS and the socket clamp puts pressure on the side edges of the IHS if the loctite dried in a position that didn't match up properly to the socket clamp pressure. Maybe this caused the IHS to pull away from the die slightly?

Actually, yes when you tighten that clamp down it's only supposed to be enough to hold it in place. I know the kit doesn't really explain it but the way it's designed it should only be holding it in place until the glue hardens.

Great to hear it's working the way it should now!