[SOLVED] What Thermal Compound application method would you recommend for the Ryzen 9 3900X (Vertical Line, Middle Dot, etc)?

[SHGSMIDT]

What Thermal Compound application method would you recommend for the Ryzen 9 3900X (Vertical Line, Middle Dot, etc)?

 

[mitch074]

Probably the spatula.

 

[Eximo]

Smear it everywhere, three chips under there.

Maybe three vertical/horizontal lines. I'm struggling to find a side by side of the heatspreader removed to see where the chips end up when installed in a board.

 

[rigg42]

I've been going with the 5 point method.

 

[CountMike]

Method should not make any difference at all if paste spreads out evenly across whole surface. All those methods are just so paste spreads over IHS evenly and covers whole surface.

 

[Baumber]

an X in the middle of the heat spreader and small dots between every "V".

 

[boju]

Smear it everywhere, three chips under there.

Like this 😀?

 

[judal57]

i used LM with the noctua NH-12A cooler

 

[rascalov]

Hello. Use line method. I did it this way and I lowered the temperatures by 10 degrees in load.

 

[truegenius]

evenly spread it across ihs, any excess will get squeezed out and will have minimum chance of air bubbles, more paste is better than not enough.
and watch this video of thermal paste application comparison

View: https://m.youtube.com/watch?v=EUWVVTY63hc

 

[faalin]

Watch this, it really doesnt matter how you put it on as long as there is enough.

View: https://www.youtube.com/watch?v=CCqxE-5Ct3w


Der8auer defunks the air bubble myth


I normally just go with a 5 dot, 4 small in each corner and a slightly larger in the middle. My CPU is running at 5.1Ghz @ 1.36v and maxes out at 65*c in OCCT and cinebench r15 tests on a Cryorig R1.