7700k (delidded) high temp

[Julyislucky]

Hello,

I just got CLU today and had a high hopes to get lower temperature, but it turns out that after delidding and applying CLU on the die did not change the outcome. When at BIOS, the temp before and after delidding are the same which goes same to when I am actually using the computer.
I have not done the stress test as I am able to play and have no problem with the computer on 24/7. However, I have done userbenchmark which loads CPU at 100% for a brief moment and the temps range from 66 to 71. I do understand that this don't mean anything, but my cpu usage do not go above 60% and stay around 50% most of the time. Hence the temp while gaming + surfing are from 45 to 54.

I have spent some time trying to get it to 5Ghz and was able to get into windows from 1.36v. However, when I run userbenchmark and when the cpu hits 100%, the temp shoots up to 80 then get BSOD. My question is, why did delidding and applying CLU which is used by many people have no effect on my cpu? Does that mean that the cpu I have is that bad or should I apply CLU
between heatsink and cpu as well?

Im currently at 4.8@Ghz 1.25v

My cooler is Corsair H100i GT.

Please let me know what you think I can do to make a difference with CLU.

Thank you.

 

[nzalog]

Did you scrape off the black silicone?
If you only replaced the TIM without scraping it off the black silicone, a big gap between the CPU and it's lid still remains.

 

[Julyislucky]

Did you scrape off the black silicone?
If you only replaced the TIM without scraping it off the black silicone, a big gap between the CPU and it's lid still remains.

I did. I made sure that there are no residues when I was cleaning. Could it be that the metal solvent that I applied was kinda old? Like the very first bit that was applied were already dried as they were exposed to the air? Because I think I saw some little grains when I was applying.

 

[nzalog]

I think those grain might just be because it does have a point where it turns into a solid when it's a bit cold in the room. If easy enough I would just take a look to make sure you don't see the same grains protruding out now.

It's also possible you just had a well made 7700K.

 

[Julyislucky]

@ junkeymonkey Would you mind telling me how it is damaged? Because I do not see it causing any problem. Overclocking was just unstable when @ 4.9+. Did I mention that I did not expect the risk? I am asking for the thoughts on why CLU would have no effect on temp as it had on most other 7700k. Did you even read the post? I am grateful that my cpu is working fine, but thats is none of your concern. If you have nothing better to say or help just keep these useless comments to yourself.

@nzalog the liquid or grains are not protruding as I just spread the small amount on the die and spread them as instructed by many videos or guides.

 

[nzalog]

You're on an overclocking forum... Your idea of reasonable risk may not align with everyone's... live with it. Some people might tell you any overclocking can damage your CPU and you that you "should be grateful the cpu still works at all".

Nothing like a guy using any opportunity to say "told you so" when you're asking for advice (but funny enough nothing even went wrong, you're just here because you don't agree with something).
It's not useful or on subject... Unless you know where he can source a time machine.

 

[junkeymonkey]

well just rma it to intell and see what they say ?? I bet they get a laugh

how is it not damaged did the lid fall off by its self or designed by intell to be removed ?? ..lol... how come yours anit working like they claim on line in forums [lol...] ??? ya, all ways a good one

good luck

 

[nzalog]

well just rma it to intell and see what they say ?? I bet they get a laugh

how is it not damaged did the lid fall off by its self or designed by intell to be removed ?? ..lol... how come yours anit working like they claim on line in forums [lol...] ??? ya, all ways a good one

good luck

Why would he need to RMA a working CPU? "[lol...]"
Troll elsewhere.

 

[Julyislucky]

Clearly he's butt hurt looooooooooool. Of course intel would say I damaged it because I delidded and that's the risk I took, which in the end was successful as my cpu is working just fine, but still having the heat problem which was the purpose of delidding if you do not know why I delidded.

If you are being a kid and just picking a fight because I delidded, then you gotta find something better to do rather then posting useless comments here. Just like you said "seems I can find better things to do with a 350$ cpu then damage it" Go find something better to do in your life than hating.

Though, I gotta say, thanks for making me realize that this post is not going anywhere.

 

[nzalog]

the liquid or grains are not protruding as I just spread the small amount on the die and spread them as instructed by many videos or guides.

Is it adhering to the surfaces (lid and core)?

I only ask because I've seen some videos where they don't rough up both surfaces. Not 100% sure but this might result in air pockets where the CLU doesn't fill in the gap perfectly.

 

[Julyislucky]

the liquid or grains are not protruding as I just spread the small amount on the die and spread them as instructed by many videos or guides.

Is it adhering to the surfaces (lid and core)?

I only ask because I've seen some videos where they don't rough up both surfaces. Not 100% sure but this might result in air pockets where the CLU doesn't fill in the gap perfectly.

Oh you replied as I just wrote lol. By adhering to the surface are you talking about how they are kinda "sticking" together? I cannot lift them easily because its like they are "glued". Am I supposed to apply the CLU on both die and the lid?

 

[g-unit1111]

Hey guys keep it civil otherwise this topic will be locked and bans may be handed out.

 

[nzalog]

(Just ignore the PM, wasn't sure if you were gonna check here again.)

So you don't need to apply it on the bottom of the lid but once you touch the core to the lid, the lid should pick up the CLU have a nice imprint of the core on it (just a rectangle of CLU). This usually won't happen if you didn't rough up the surface.

 

[Julyislucky]

(Just ignore the PM, wasn't sure if you were gonna check here again.)

So you don't need to apply it on the bottom of the lid but once you touch the core to the lid, the lid should pick up the CLU have a nice imprint of the core on it (just a rectangle of CLU). This usually won't happen if you didn't rough up the surface.

Thanks for the fast update.

If I understand what you are saying correctly, I did not rough up the surface as I used rockitcool kits to relid the cpu. They have a nice frame to put the lid back on, so it does not move. Then I applied little grains of glues at the each edge of the lids so that the lid would stay and won't budge when locking it down the socket.

 

[nzalog]

Ahh you closed it up already.
Depending which glue you used, be very careful about taking the lid back off. I've seen people ruin the PCB because they used super glue and the glue pulled off a bit of PCB. Highly recommend you use black RTV silicone from the auto store. Looks really similar to what Intel uses. You don't even need to seal all the way around, it's just safer to remove if you ever need to again.

 

[Julyislucky]

I started this post after my second time of delidding. My first time was using artic silver 5 then this time was CLU because it arrived yesterday. And between the two attempts, I saw no difference in temperature. The lid comes off easy because I did not apply the glue under it but outside of it. Would you recommend trying and reapplying the compounds? I am a bit skeptical about not closing the lid completely(?). I feel like I did not put enough force or pressure on the lid when gluing, but rather a mild pressure.

P.S. I fully understand the danger of delidding, that's why I am asking if I should do it a thrid time.

 

[nzalog]

So couple things...
1. Not roughing up the surface on the bottom of the lid could had caused some air gaps (CLU does not stick well to the lid at all).
2. Judging from what you said you had enough pressure. I was a bit excessive when I relided mine, I used a spring clamp from Harbor Freight to hold it while drying. I used two pieces of dense and thick foam to protect the CPU from the pressure of the spring clamp.

Here is an example of what i mean by spring clamp (remember, I had a lot of foam protecting the CPU from the pressure).
http://www.harborfreight.com/media/catalog/product/cache/1/image/9df78eab33525d08d6e5fb8d27136e95/3/9/39529_zzz_500.jpg

You don't need to use exactly that but it's probably a good idea to have a good amount of pressure pressing the lid to the CPU while the glue dries.

Lastly, like I said before... You may have already had a CPU that was made well by Intel which is why you're not seeing improvement.

 

[Julyislucky]

Thanks, you may be right. I will try it again one last time, and if I don't see any improvement, I will just live with 4.8.