News AMD and Raytheon team up for advanced chip packaging for military applications

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Perhaps the US should get their stuff from locally sourced production. Not that Raytheon just sells to the US, but it would be a safer bet to count on the delivery of stuff made in the US or EU if a reason to use military products arose. And safer to go with a company that does source production more locally.

Also X3D is TSMC developed packaging. AMD just put in the order and worked with TSMC to get it done. They don't directly do packaging and have very limited knowledge of it relative to Intel. Teaming up with AMD to get help with something that AMD isn't the expert in is suspicious. Maybe it is just about some people finding a way to line their pockets.

Edit: Also Intel just opened up Fab 9 in New Mexico to do just this kind of packaging while AMD has to send their stuff to Taiwan to have them do it.
 
Perhaps the US should get their stuff from locally sourced production. Not that Raytheon just sells to the US, but it would be a safer bet to count on the delivery of stuff made in the US or EU if a reason to use military products arose. And safer to go with a company that does source production more locally.

Also X3D is TSMC developed packaging. AMD just put in the order and worked with TSMC to get it done. They don't directly do packaging and have very limited knowledge of it relative to Intel. Teaming up with AMD to get help with something that AMD isn't the expert in is suspicious. Maybe it is just about some people finding a way to line their pockets.

Edit: Also Intel just opened up Fab 9 in New Mexico to do just this kind of packaging while AMD has to send their stuff to Taiwan to have them do it.
I was thinking much along the same lines. Unless amd/tsmc are using US based fabs for this joint venture.
 
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