Cazalan :
blackkstar :
http://www.globalfoundries.com/technology/14XM-FAQ.aspx
GloFo is already claiming that tape-outs should be happening in 2013.
Also, yes, the xbit article is high on speculation. But they are also speculating that 14nm will only be used for mobile parts while GloFo is claiming it can scale to multi-core and advanced servers.
There is a lot of contradicting information and whatever side you pick probably depends on if you're more optimistic or pessimistic about AMD. I'm personally more optimistic but that's just me.
I have no doubt AMD is playing the best possible hand they can with the cards they were dealt.
That GF page says they were expecting deliveries of 20nm in 2H20
12. We're a year beyond that and I don't think any 20nm part from GF has hit the market yet. Kaveri will likely be the first 28nm part.
AMD has sizable wafer commitments to GF and they're currently all 32nm. Something just doesn't add up there. Now GF is talking about 14nm. That's 3 deep in the pipeline of vaporware (28nm/20nm/14nm). Maybe I missed some press releases but has anyone found any chips GF made with these nodes?
My point is that GloFO can not keep having vaporware nodes. They have to be cancelled for a reason and I'm suggesting that the reason is that they are just moving faster and cancelling what they were working on.
GloFo is backed by ATIC and a whole lot of oil money. I really wouldn't be surprised if the folks in charge of GloFo had no qualms about just tossing money away.
Also, the Extreme in Extreme Mobility can either mean it's
1. Made for extremely mobile products
2. is designed for mobile products but can scale extremely well to higher end products.
I have not seen proof towards either one, however I am at least pointing out that there are alternatives to the suggestions provided about 14nm XM. For all we know GloFo got lucky and has a 14nm/20nm hybrid process that sips power and scales better than everyone else. Or worst case it is another vaporware product.
Also, new roadmaps from AMD:
http://www.slideshare.net/wilfredlin/amdembeddedroadmapunveilvfinal-130906181555
Of note (copy pasted from my OCN account of a different name)
1. AMD is not telling us what 60% to 50% of their future business plans are (slide 3).
2. ARM is not replacing Steamroller APUs (slide 9)
3. ARM is not replacing Jaguar (slide 9)
4. AMD is not even getting close to replacing Jaguar with ARM as the only ARM part on slide 9 is an (up to) 8 core A57 APU
Thus, I think it's safe to infer that:
1. AMD's products are either mobile/embedded or classic HEDT/server. If AMD is moving 40% to 50% of their product lineup to mobile/embedded high growth markets, it means that the remainder can ONLY go to HEDT/server as that's the only other things AMD makes
2. AMD has a Steamroller v2 out there and it has better HSA features according to these slides.
3. AMD has little faith that ARM will cause a massive disruption in x86 but instead will co-exist.
AMD's own market projections have ARM taking about .5% from x86 and .5% from MIPS by 2016. That is hardly disruptive at all.
I find it curious that there are no low power ARM chips with GCN cores. Perhaps AMD is looking at Tegra and realizing doing something similar is a giant waste of time and resources. Regardless it means Temash is here to stay.
Surface 2 Pro reviews popped up today with the new Haswells.
http://www.anandtech.com/show/7440/microsoft-surface-pro-2-review/4
~50% increase in battery life and it still is blown away by ARM. And this is what Intel is optimizing their big cores for.
Now do you see why I think it's absolutely foolish for AMD to walk away from the HEDT/Gaming CPU market? They can beat Intel with Temash and then beat Intel in HEDT because Intel is off trying to compete with efficient, simple RISC ARM designs with a bloated x86 CPU.