Goodness this article is terrible,. The combined capacity will primarily be 45nm. As other have mentioned the "taking orders" cannot be CPU's because who makes CPU's? (Intel, AMD) The foundry doesn't need to take orders from AMD (it's in the contract) and I'm pretty sure Intel will not be using the foundry for it's CPU.
The 32nm production mentioned here is the bare Si process which will be a lower performance process and will not be making CPU's. When the foundry gets around to 32nm SOI (late 2010/12011) then that will mean 32nm CPU's.
Also your quote on the NY fab is ALSO WRONG. At FULL CAPACITY/BUILDOUT it will be capable of ~30-35K wafers/month, BUT NOT IN 2012! (Hint - look at AMD's own analyst day foils)
Is there anything in this article the author managed to get right?