News AMD Says It Could Bring Chiplets to Thinner Ryzen Laptops

Leading up to the launch of RDNA3, AMD said it made huge breakthroughs in the efficiency of die-to-die communication. Perhaps that's the new enabler for using chiplets in laptop processors.

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I think AMD has to be selective about using advanced packaging while TSM is expanding their CoWoS capacity over the next year to service the ai chip demand.
 
Right now, the AMD's Ryzen 3000, 5000 and 7000's chips has a considerable distance between the IO Die and the compute dies which cause this kind of power penality. Perhaps it is possible to do this by copying Apple m1 max/pro SOCs by putting 2 chips together.