Except that they are not smaller when compared like for like. Not by a long shot. Intel is doing hybrid in a monolithic die (the 12900K has die size of 209mm2) that contains 16 cores (8P+8E). AMD is doing MCM with 2 octacore compute chiplets (2x80.7=161.4mm2) + one IO die (125mm2) that add up to a total area of 286.4mm2. And let’s not forget that Intel’s die includes several features (that take a lot of area) that AMD cpus don’t have: igpu, AVX512 units (and that with several extensions), PCIe5, more chipset lanes, a memory controller with support for both DDR4 and DDR5, etc). If we were to exclude those, we are talking about Intel using less than half the total die size. As for of the 4 tiles in Sapphire rapids each has 18 cores (at first 14 active). Again over double the cores per tile so not comparable. And these cores are bigger in compute resources and with more features than Zen cores. And we don’t have dimensions for those yet. In any case AMD assembles a 9-chiplet monstrosity (8 compute chiplets plus 1 io die) with a much bigger total area .And they are not doing this out of choice but out of necessity. If AMD were to produce a larger chiplet die they would have yield issues. Intel on the other hand, having full control of their process (which now is anyway superior to TSMC's 7nm) can optimise for larger die size production in a way that in mass production can have just as good (or about as good) yields as AMD has with their smaller chiplets.