goldstone77
Distinguished
Gon Freecss :
This is from a top guy at GloFo. So, it seems AMD will most likely be using TSMC in 2019. That process isn't as good, and Intel's 10nm process is even better than GloFo's (10nm+ is ~10% denser than 10nm and can hit higher clocks).
Do you have a link to the source? Those statements are kind of vague. But this is what Lisa Su told Ian in an interview.
Getting Radeon Vega Everywhere: An Exclusive Media Interview at AMD Tech Day, with CEO Dr. Lisa Su
by Ian Cutress on January 24, 2018 8:00 AM EST
https://www.anandtech.com/show/12312/getting-radeon-vega-everywhere-an-exclusive-interview-with-dr-lisa-su-amd-ceo
Q18: With GlobalFoundries 14nm, it was a licensed Samsung process, and 12nm is an advancement of that. 7nm is more of a pure GF design. Is there any change in the relationship as a result?
LS: So in 7nm, we will use both TSMC and GlobalFoundries. We are working closely with both foundry partners, and will have different product lines for each. I am very confident that the process technology will be stable and capable for what we’re trying to do.
Intel's 10nm+ is more dense than GlobalFoundries, because Intel uses single dummy gate, and contact-over-active-gate.