News BBCube 3D Memory Claimed to Offer 4x the Bandwidth of HBM2E

[Admin]

BBCube 3D Memory offers much better bandwidth than HBM2E and can be used to connect CPUs and GPUs, say researchers.

BBCube 3D Memory Claimed to Offer 4x the Bandwidth of HBM2E : Read more

 

[Metal Messiah.]

A similar concept was also worked on before, in 2022, although not same, but it was described as Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI).

This was a quite interesting research paper though. Worth giving a read. Bumpless interconnect tech increased the number of TSVs per chip due to the finer TSV pitch and the lower impedance of bumpless TSV interconnects.

So when wafers with micrometer thickness were stacked, the total thickness was reduced, and the transistor capacity increased in proportion to the number of wafers.

Increasing the TSV interconnects density enabled terabyte-level bandwidth without sacrificing energy efficiency

Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)

Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bumpless interconnects between wafers and between chips and wafers are a second-generation alternative to the use of micro-bumps for WOW and COW...

www.mdpi.com

 

[Metal Messiah.]

Oh btw, they are the same group of researchers.

 

[Kamen Rider Blade]

How the heck are you going to cool it?

All those layers stacked, what about the heat that is near the centers and not near the edge of the structure?

 

[TechyIT223]

Sounds interesting in theory but can they implement this without any complications? Heat should not be that much of an issue imo