Actually whats' most important is the application of the thermal compound to get it's full thermal conduction!
Both of what you list have their plus and minus, AS5 needs a long time to cure to it's best thermal conduction state, which means it actually needs a thermal layer for micronized particles to fully do what it is advertised and claimed to do.
IC Diamond needs a 50psi clamping pressure to perform optimally, (check their website for details), also IC Diamond has had many claims against them for heat spreader scratches from those moving the heat sink back and forth attempting to get better contact with lower pressure and scratching the CPU heat spreader, costing the CPU warranty. (Hello it's micronized diamond particles, and...