Each memory chip consumes power, so having twice as many is twice the load to the motherboard's VRMs. DDR5 is unique in that the power supply for the memory is onboard the memory itself and no longer relying on power from the CPU.
Still, the memory controller on the CPU (or I/O die in the case of Ryzen) means that having four sticks means double the processing taking place in a small area and through the traces on the motherboard. Generally speaking this means that higher speeds are not possible. So if bandwidth is important you want the smallest number of larger sticks. If capacity is most important, you also want density. 196GB is possible using 48GB sticks, but you can expect this to be at 4800MT/s rather than a potential 6000-6400 for Ryzen.
Lexar has been making memory products for a long time, but they have never been a memory manufacturer as far as I know. So they are using someone's chips and simply packaging the memory. SK Hynix, Samsung, etc not sure who all is making DDR5 as of now.
This, or, in laymans terms, regardless that SOME will try to use obscure findings to tell you otherwise for a few platforms, the bottom line is that four DIMMs presents twice the electrical stress on the memory controller, and thus, the CPU, as two DIMMs does. Twice the electrical stress also means, more heat, more electromigration potential, and a much higher chance of a reduction in the quality of signal integrity. Which is not to say that systems cannot utilize four DIMM configurations. They can, of course. But it is basically almost always a better choice, on consumer platforms at least, to use only two DIMMs, IF you can achieve the same desired overall capacity, because it's less stress on the IMC and it's generally also cheaper. A 32GB kit that consists of 2 x16GB is almost always going to be cheaper than a 32GB kit that consists of 4 x8GB, assuming that we are talking about a SINGLE matched set and not four individual DIMMs or two 2 x8GB kits. Doing THAT, opens you up to WAY more probability of compatibility issues among the DIMMs. That's another concern as well. The more DIMMs involved, the greater the chances that something is not going to want to "play nice together".
It also VERY MUCH depends on the configuration of the modules. Your video above is irrelevant. Any idiot can make something look legitimate on there. We see it all the time. The bottom line is, it is 100% dependent on the platform, the specific modules including whether they are a certain frequency, whether they are dual rank or dual rows, what ICs are used, and the CPU/IMC architecture. One set of 4 DIMMs might present one picture, while another on the same platform presents a totally different one. And in EITHER case, they are going to present a greater level of stress to the internal memory controller because, it's physically not possible for it not to. Now, depending on the platform, that increase in stress on the IMC might not matter, but it also might not offer any tangible benefits. Believe me, I've seen dozens of very astute reviews that were entirely in conflict with dozens of others, all of which were done by well respected members of the tech community. And the biggest, most important issue, is always, BUY IT ALL IN ONE KIT, regardless of whether it's a 2 DIMM kit, a 4 DIMM kit, a 6 DIMM kit, an 8 DIMM kit, or whatever.
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