News Cubic Boron Arsenide Promises 10x Better Heat Dissipation for Chips

Jul 26, 2022
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It’s not just the thermal conductivity of the bulk semiconductor material, but also at the interface to heat sink or spreader. An oxide layer always forms on exposed metal. Special techniques are necessary to remove the oxide layer and bonding to the heat sink.
also , isotopically pure Si 28 has much better thermal conductivity than natural. A company tried this 20years ago