Delidding CPU and applying liquid metal

[phillipisnumberone]

I recently built a pc and got an intel 8700k. I overclocked it to 5.0ghz with 1.3v. When I use prime95, my temps go all the way up to 90-100C. I was wondering if delidding your cpu and applying liqud metal would significantly decrease my temps. I looked online I and I saw that Thermal Grizzly is a pretty good heat sink compound

 

[phillipisnumberone]

I also have a Kraken x62 so it would compatible because I heard this doesn't work on aluminum heat sinks

 

[Greeko85]

Delidding can greatly improve your temps but be aware its a very delicate and risky procedure- you can easily destroy your cpu if not done properly so be confident in your skills before trying out.
As far as the kraken x62 goes I'm positive the contact plate is copper- the only aluminium I can think of would be the rad itself.

 

[CompuTronix]

... 8700k ... overclocked to 5.0ghz with 1.3v. When I use prime95, my temps go all the way up to 90-100C ...

Q: Which version Prime95?

Any versions later than 26.6, such as 29.4, run AVX code on the CPU's Floating Point Unit (FPU) which can cause unrealistic Core temperatures up to 20°C higher than version 26.6.

• Prime95 v26.6 - http://www.mersenneforum.org/showthread.php?t=15504

Q: What is your ambient temperature?

You can safely delid by using a "delidding tool":

• Rockit 88 - $39.93 - https://rockitcool.myshopify.com/
• der8auer Delid Die Mate 2 at Newegg - $42.99 - https://www.newegg.com/Product/Product.aspx?Item=9SIA4YU6Z97125&ignorebbr=1&nm_mc=KNC-GoogleMKP-PC&cm_mmc=KNC-GoogleMKP-PC-_-pla-_-Memory+%26+Chipset+Cooling-_-9SIA4YU6Z97125&gclid=CjwKCAjwpeXeBRA6EiwAyoJPKmMY5xdXjV_txekd7EkFEovTiKS-Ma0s7Nt2PlfHRWBRoJNOvCiK3RoCn_sQAvD_BwE&gclsrc=aw.ds

If you don't feel confident to try delidding, then just send your 8700K to Silicon Lottery - https://siliconlottery.com/collections/all/products/delid

They're a company that tests, bins and sells overclocked, delidded "K" CPU's. They also offer professional delidding services for a fair price, with quick turnaround time and a warranty.

If you delid the CPU yourself, then be certain to use Thermal Grizzly "Conductonaut" (liquid metal) only between the Die and the IHS, and Thermal Grizzly "Kryonaut" (silicon compound) only between the IHS and the cooler. You can expect Core temperatures to decrease ~ 18°C.

CT

 

[izoli]

Der8auers delidding tool is very simple and yeah it will help quite a bit, worst case you will probably see about 10c drop, more likely closer to 20c. Just be sure to barely cover die and bottom of IHS where it will sit on die with liquid metal so that it will have proper contact and no spillage. I also used conductonaut for die to ihs and kryonaut for ihs to heatsink.

Also be sure to clean silicone glue off and apply only a thin layer when re-attaching. I used permatex ultra black gasket maker, doesn't have that acid vinegar smell to it that a lot of silicone gasket makers do and is generally recommended from what I see.

 

[phillipisnumberone]

Delidding can greatly improve your temps but be aware its a very delicate and risky procedure- you can easily destroy your cpu if not done properly so be confident in your skills before trying out.
As far as the kraken x62 goes I'm positive the contact plate is copper- the only aluminium I can think of would be the rad itself.

Yeah I understand that one mistake could mess up my pc. As long as I don't get the liquid metal on anything other than the cpu i am fine right?

 

[izoli]

Delidding can greatly improve your temps but be aware its a very delicate and risky procedure- you can easily destroy your cpu if not done properly so be confident in your skills before trying out.
As far as the kraken x62 goes I'm positive the contact plate is copper- the only aluminium I can think of would be the rad itself.

Yeah I understand that one mistake could mess up my pc. As long as I don't get the liquid metal on anything other than the cpu i am fine right?

As long as it doesn't get on anything that can be shorted, if it gets off the die and onto the silicon chip it's fine just clean it up before putting it back together.

 

[CompuTronix]

phillipisnumberone,

You don't have to perform the delid yourself. See my post above.

If you do choose to perform the delid, then take note; on the top of the "substrate" which is the green circuit board where the silicon "die" is located, there are several small gold test points similar in appearance to those on the bottom of the substrate that contact the socket pins. If the smallest amount of liquid metal happens to short these test points, it can kill your CPU.

So before applying any liquid metal, be certain to use clear nail polish to insulate these gold test points from potential "micro-splatter" which can go unseen.

CT

 

[The Original Ralph]

CompuTronix - curious why you only recommend the Conductonaut for use between the die and the IHS, and Kryonaut for use between the IHS and the heatsink?

never mind, i'm pretty sure i figured out why

 

[CompuTronix]

Good question, Ralph,

Although the obvious reason is that liquid metal rapidly corrodes aluminum, which the base of some coolers contain, the less obvious reason, other than thermal conductivity, is "pump-out". But before I explain that, here's the short list in order of thermal conductivity:

Indium - 81.8 W/mk (Used in processors with soldered IHS)

Liquid Metal (IHS to Die)

Thermal Grizzly Conductonaut - 73.0 W/mk
CoolLaboratory Liquid Ultra - 38.4 W/mk
CoolLaboratory Liquid Pro - 32.6 W/mk

Typical Silicon TIM (IHS to Cooler)

Thermal Grizzly Kryonaut - 12.5 W/mk
Arctic Silver 5 - 9.0 W/mk
Arctic Cooling MX4 - 8.5 W/mk

Delidding requires that you use only liquid metal between the Die and IHS. Typical silicon TIM will fail in a relatively brief period of time. A process known as “pump-out” will cause silicon TIM to ooze out from between the Die and IHS due to thermal cycling. The result is Core temperatures that begin low and gradually increase according to how often you use your PC, and under how much load.

The effects of pump-out can become apparent in as little as 2 weeks, depending on which "brand" of silicon TIM was used. Arctic Ceramique stands up comparatively well, but also fails within about 2 months. Regardless of the "brands" used, TIM failure requires another delid and TIM application.

Although Intel's much criticized TIM is highly resistant to "pump-out", some 3rd and 4th Generation 22 nanometer processors, (launched 2012 through 2014), may no longer cool as well as when new due to "dry-out". When these older processors are delidded, Intel's TIM has the consistency of chalk.

Now that Intel is soldering 9th Generation processors, here's a good read that explains why Intel switched to TIM on 3rd Generation, and the problems involved with soldering "small die" processors: The Truth about CPU Soldering - http://overclocking.guide/the-truth-about-cpu-soldering/

Although 9th Generation is soldered, the Die and solder are both considerably thicker than earlier Generations, which adversely affects thermal conductivity. Here’s a detailed explanation by Mechatronics Engineer, Roman “der8auer” Hartung - https://www.youtube.com/watch?v=r5Doo-zgyQs

CT