digitalgriffin
Splendid
All the pictures I've seen show sharp corners.The corners are radius'd......
This is just the relative distance from the that nearest mounting hole to the edge of the PCB.
All the pictures I've seen show sharp corners.The corners are radius'd......
This is just the relative distance from the that nearest mounting hole to the edge of the PCB.
Guess it depends on your definition of "sharp"All the pictures I've seen show sharp corners.
That's a sharp corner. Tighter radius equals higher stress.Guess it depends on your definition of "sharp"
The viscosity of the compound and mounting force surely had something to do with it. With enough force, you could theoretically force most of the excess out, if it's not too viscous.Trying to find the video that jayz2cents did a few years ago where he tested varying amounts of thermal paste on a GPU to counter the argument of too much paste and each time the temperatures were within 2C or so of having the right amount of paste, with it only getting significantly worse when he used nearly an entire tube on the GPU.
The viscosity of most thermal pastes are such that the mounting pressure will squeeze out all excess until the higher parts of the die and the HSF are touching with only the remaining paste filling the gaps. There is a lot of mounting force and its not exactly hard putty that's being squashed.The viscosity of the compound and mounting force surely had something to do with it. With enough force, you could theoretically force most of the excess out, if it's not too viscous.