Does anyone know if they're still making 12nm chips?
A 7nm fab costs ~10G$ to build, so I think we can say with pretty high confidence that 4G$ must be 14nm-class.
The fab is earmarked primarily for analog, RF and power management stuff which doesn't need bleeding-edge process tech: analog stuff requires bulky relatively high current components and traces, RF requires relatively large planar passive components along with possibly significant power and power management stuff requires large transistors, all stuff that does not benefit much from process shrinks except for tighter tolerances, higher yields.
Using a 14nm-class process to make parts that would likely be perfectly fine on 45+nm does have the benefit of opening the option to make stuff down to ~14nm should the need arise.
As I have written in previous threads about GloFo's "imminent" demise, everyone will need someone to make interposers and substrates of all sorts when all major chips go with some version of 3D-stacking and 12-22nm will also be perfectly fine for that. It may not be as glorious as making the bleeding-edge parts of future chips but it should keep GloFo afloat for the next 10+ years.