Haswell CPUs to Top Out at 3.5 GHz

Page 3 - Seeking answers? Join the Tom's Hardware community: where nearly two million members share solutions and discuss the latest tech.
Status
Not open for further replies.
[citation][nom]jacobdrj[/nom]I am still rocking a Core 2 Quad 6600 at stock and even as a gamer, I see no compelling reason for me to upgrade. I don't edit much video, I don't encode video/audio. I just play the occasional 3d game and browse a bunch of web sites on my 1900x1200 LCD with a 6950 and 8GB of DDR2...The SSD has made the CPU upgrade a low priority upgrade...[/citation]
Well, simply moving from DDR2 to DDR3 yielded a performance gain for me. Try playing a game like Planetside 2, i'm so CPU bottlenecked (have a Q8400) at times that i the fps drops below 20. Even BF3 is CPU bottleneced in the multi-player. So yeah modern games aren't too playable/smooth anymore, and i haven't even tried Skyrim yet. I do encode video too, AND i have an SSD, but believe it or not the SSD (and my RAM) is getting bottlenecked by my CPU. OC'd recently, could only get a measly 4%.

[citation][nom]Sakkura[/nom]The SB -> IB transition was a die shrink or "tick", Haswell is a new architecture or "tock". This is supposed to yield a greater performance boost than a tick. Just look at what a success SB was in its day.I don't expect quite that big of an improvement in x86 performance though, since they're focusing more on the IGP. Should still be a decent step forward though, unless they're trying to give AMD a reprieve or something.[/citation]
Ah, should have been clear, i meant *expected* performance difference, even by intel, isn't going to be a whole lot more than Ivy. What i read on Anandtech was that the major arch changes are apparently going to be made with broadwell. They've sort of started mixing the tick-tocks you know, sometimes i feel that the Haswell/Broadwell cycle will be the last tick-tock, after that it'll be this mixed tick+tock thing.
 
these are just a tick tock tock.

same cpu, just revised pathways, meaning less pins and the latest igpu, vt-d and some power thermal issues that don't quite make sense. almost as if the chip is just a failed 4770k (2700k) that could only pass the highest test as a lower end scale part.

i mean why put out something really better, they are 3 gens up on anything amd is putting out.

this is why you need amd around. other wise you'd still be stuck on P4.

i think the best way for AMD to get back in the game is to drop 64 bit until they can. also wouldn't hurt to make 8-12MB cache standard (2MB per core). amd would probably also have to go quad channel just to get back on the same playing field?

just a bunch of minor tricks but that's the only thing they can do given current design tech they are using i think.
 
[citation][nom]keither5150[/nom]I have a 6 year old i7 920 and a newer 2600k machine. Both have dual 6950's. I see no noticeable difference in gaming. My buddy has a newer 3750.... I think. He also has dual 6950's. I don't see that his machine does anything faster than mine.I think that my 920 will last a long time...... I did add a high end SSD to it lately.[/citation]

Yep, not much progress on that front. However, when you consider that entry mobile i7's at 45 watts (with integrated grahics) perform better than the i7 920 at 130 watts you see the progress intel has made.
 
[citation][nom]hannibal[/nom]Yep. If you want to overclock. Sandy is still the best option![/citation]
you realize higher clock speeds don't mean anything right? clock for clock, each intel processor has been superior. im guessing haswell at stock will mess with OC'd sandy bridge
 
[citation][nom]eklipz330[/nom]you realize higher clock speeds don't mean anything right? clock for clock, each intel processor has been superior. im guessing haswell at stock will mess with OC'd sandy bridge[/citation]

Actually, hannibal is partially right, although the overclocking advantage of Sandy over Ivy is very small. Ivy's clock for clock improvements weren't quite enough to offset the lower overclocking caused by the crap paste. Ivy only wins if you remove the IHS and switch out the paste for some high thermal conductivity paste or a similar procedure. Haswell at stock is very unlikely to meet Sandy with an overclock unless the difference between Haswell and Sandy is greater than the difference between Core 2 Quad and Nehalem, a very unlikely scenario.
 
I'm a little surprised that I didn't see anyone mention in the comments that this chart could be bogus, or that it could be true but not necessarily the final thing. I think it would be best to take it with a grain of salt like many before me have said. I might be missing something though...something that absolutely proves this list is authentic. :)

I think Wolfgang was still onto something with the IGP, though I won't discount what you've presented so far as possibilities. Anyway, one thing of note is that "normal power" Ivy Bridge i7's and i5's all (?) have a 77W TDP, but the thing is the difference between them and Haswell (which should be more power efficient) is that the Haswell CPU's have that new IGP, and they all do have that 84W TDP (according to the chart). A case could be made by the fact that some of those quad-core Ivy Bridge i5's have the weaker Intel HD 2500 graphics, but that is peculiar that they still have the same TDP. Maybe it's because they're lower-binned chips and thus tend to use more power and generate more heat (though I'm not sure about this, like if lower- and higher-binned chips with the same clockrate and voltage would have any power consumption or heat differences). Anyway, it's just a thought/possibility as well.
Or, this chart, just maybe, could be bogus like I've said... :)

Just wanted to point this out. You may have meant either "32nm" or "IB-E" since SB-E's use 32nm right? :)

But maybe we should ask ourselves, do we really need more than quad-core CPU's? Would the majority of us really have a better usage experience with more cores? If not, then why would Intel even bother for now?
 
[citation][nom]keither5150[/nom]I have a 6 year old i7 920[/citation]Last I checked i7's weren't around in 2006.

[citation][nom]mousseng[/nom]Why? Those extra cores won't benefit you unless you're doing heavily-threaded work (video rendering, image manipulation, 3D modeling, etc). I'd rather have fewer stronger cores, as that'd be more universally helpful since most programs can't leverage that many threads.Also, the higher TDP has me at a loss as well - are they having more heat issues?[/citation]I do use heavily-threaded work. If I want to buy a cheap 8-core Intel chip I should be able to do so in 2013 without breaking the bank. The option should be there for those who need it and it should be affordable (cheaper than current i7's too!)

[citation][nom]kj3639[/nom]I'm sticking with Sandy Bridge for a while. Intel's newer processors just increase IGP performance and CPU power efficiency, which is great for laptops, but I could really care less in a gaming system.[/citation]You mean couldn't care less.

[citation][nom]deksman[/nom]SB yielded biggest performance boost from architecture modifications compared to its predecessors.[/citation]Umm.. Pentium 4 -> Core 2 Duo? Were you sleeping when that happened?

[citation][nom]ojas[/nom]Well, simply moving from DDR3 to DDR2 yielded a performance gain for me.[/citation]You mean the other way around, right?

[citation][nom]f-14[/nom]i think the best way for AMD to get back in the game is to drop 64 bit[/citation]
That is without a doubt the most idiotic statement I've ever read.

[citation][nom]eklipz330[/nom]you realize higher clock speeds don't mean anything right?[/citation]Not exactly. While it's true that stock Haswell will probably be relative to an OC'd Sandy, the Sandy OC'd matches and exceeds an OC'd Ivy.

[citation][nom]army_ant7[/nom]Just wanted to point this out. You may have meant either "32nm" or "IB-E" since SB-E's use 32nm right?[/citation]Thank you for pointing that out. Some people don't pay attention.
 
[citation][nom]army_ant7[/nom]I'm a little surprised that I didn't see anyone mention in the comments that this chart could be bogus, or that it could be true but not necessarily the final thing. I think it would be best to take it with a grain of salt like many before me have said. I might be missing something though...something that absolutely proves this list is authentic.[/citation]
Haha, the thought crossed my head initially, but frankly this is pretty much believable and consistent with current stuff. If you remember the Nvidia Kepler leaks, they were pretty outlandish at first so people rejected the initial leaks till they made more sense. But yeah i think i've seen enough leaks to tell bogus from real ones (or so i hope! 😛). The only thing that's missing is more info on the IGP. See, Haswell has grades of the IGP, GT1, GT2 and GT3. What i don't know is whether these are subsets of HD4600 or not, and if they are, then the TDP numbers will make more sense, which in case Wolfgang would be right. Sadly this news is coming from him, not Chris/Don/Thomas/Paul or even Doug, who usually used to cover hardware news.

[citation][nom]army_ant7[/nom]I think Wolfgang was still onto something with the IGP, though I won't discount what you've presented so far as possibilities. Anyway, one thing of note is that "normal power" Ivy Bridge i7's and i5's all (?) have a 77W TDP, but the thing is the difference between them and Haswell (which should be more power efficient) is that the Haswell CPU's have that new IGP, and they all do have that 84W TDP (according to the chart). A case could be made by the fact that some of those quad-core Ivy Bridge i5's have the weaker Intel HD 2500 graphics, but that is peculiar that they still have the same TDP. Maybe it's because they're lower-binned chips and thus tend to use more power and generate more heat (though I'm not sure about this, like if lower- and higher-binned chips with the same clockrate and voltage would have any power consumption or heat differences). Anyway, it's just a thought/possibility as well.Or, this chart, just maybe, could be bogus like I've said...
[/citation]
1) See the GT1/2/3 thing above for the Wolfgang IGP thingy.

2) See, TDP isn't a direct indicator of power consumption. It simply indicates that a cooler will have to be able to deal with 84W of heat if the CPU reaches Tjmax, which is 105*C. At least, that's what i got from Intel's footer here:
http://media.bestofmicro.com/N/1/363709/original/intel_ivb_10w-665x435.jpg

But power consumption is close enough to TDP at times. I remember watching those 17w ULV chips hit 15w at full CPU+IGP load, and the chip was hitting 75*C. I doubt 2 more watts would have taken it to 105*C, but if i knew for sure i'd probably be at intel by now 😛

I've seen my own system's power consumption go up by 65-70w under prime95, with the processor staying under 55*C, which varies from core to core. Anyway, my CPU has a 95w TDP, and i'm sure that it must take at least 20w to idle at 2GHz (i have power saving options enabled), so that's about 85 to 90w. And my chip's Yorkfield, so that's 4 generations behind Haswell.

How does this relate to what you're saying? Well, even if two chips have the same TDP, it doesn't mean that they'll consume the same power. Just like Pentiums and Core i3s have the same TDP, despite a lot of difference in clock speeds.

Then the defects and binning. What i would assume is, binning by disabling defective parts of the chip would reduce power consumption, but a defect that's allowed to operate MAY consume a teeny tiny bit more power (because of things like increased resistance or something, i guess) but seeing that these defects are going to be extremely small (maybe a few hundred transistors i suppose, though i think that'll be too big to NOT disable), i doubt it'll increase the power consumption in any noticeable way. Maybe a micro watt or so more. Or a nano watt (if 1B transistors consume 77W, then 1 transistor would consume about 77nW, by an extremely simplified calculation). So i don't think defects have anything to do with it, it's just easier for Intel to organize chips like this, i guess. Maybe they've certain dies for each power target, and they simply bin them according to what they want the chips to do.

If the i7-4770S can hit 3.1 GHz and turbo till 3.9 within an envelope of 65w, i'm sure you could pull of a 3.5 base clock within 70w. So that's 14w (19w over the 4770S btw) more for? The same IGP at the same (or almost the same) clocks? Nah, i don't buy it. Either there's something more to the IGP, or it's something to do with the heat spreader.

Interesting thing i found on Intel's website:
http://www.intel.com/support/processors/sb/cs-033342.htm

So i guess for desktop processors, the TDP is defined at Tcase, not Tjmax. Now I'm just confused :lol:. HD 4000 graphics to 4600 graphics increases transistor count and doubles the clock speed, the Haswell->Ivy transition should see roughly the same transistor count and we see the same clock speeds, yet even after considering both things, they've manage to keep the 4770S's TDP at 65w, but they found it necessary to increase the TDP of the "standard power" parts.

I have a deep suspicion it's to do with the IHS.

The 3570K has a Tcase of 67.4*C and a TDP of 77w
The 2500K had a 95w TDP, Tcase of 72.6*C
The i5 750 had a 95w TDP and a Tcase of 72.7*C
The Core 2 Quad Q8400 had an 95w TDP, Tcase = 71.4*C

So that's only a ~1*C diff at the most change despite a die shrink and new archs (b/w Yorkfield and SB), so Tcase is very closely related to TDP for a given core count (Bloomfield appearing to be the notable exception) and possibly the same type of transistors.

Sandy overclocks better than Ivy, eh? Even those Nehalem i5s were good overclockers, i remember reading. Could there be a co-relation between overclocking and a higher Tcase/TDP?

Definitely should be a relation between Turbo mode and Tcase, but the OCing part is where i'm really interested (though regular folks will benefit more from extended Turbo periods).

So let's see, 72/95 < 67/77. Assuming that CPUs using the same lithography and same tri-gate transistors will have the same Tcase/TDP ratio, (67.4/77) * 84 = 73.527*C for Haswell.

SO. SO SO SO.

IF this is right, IF the Tcase of these chips will be higher than Sandy, IF the IHS is soldered, IF so many other things i probably don't understand are true as well, WILL THEY DO 5+ GHz ON AIR ...?...?...? :O

I think they might. 😀

[citation][nom]army_ant7[/nom]
Just wanted to point this out. You may have meant either "32nm" or "IB-E" since SB-E's use 32nm right?[/citation]
Ah thanks, i meant IB-E. Will correct it...
 
I do remember this one leak that was wrong: Nvidia GeForce GTX <b>650</b> Ti Specifications Leaked which contradicts the real specs shown here: http://www.geforce.com/hardware/desktop-gpus/geforce-gtx-650ti/specifications
It just goes to show that we do need to keep our guard up, but I think I have seen credible leaks as well. If you think about it though, what's the point of leaks and rumors (other than to get us all excited, or just plain fun) when you'd have to wait for the official word or product to come out to confirm them? Hehehe... 😛

What's up with the negativity BTW with Wolfgang presenting news like this? Because he might've (just might) not gotten into the details and observations that the other editors might've? (To tell you the truth, I think Zak Islam has shown the poorest workmanship overall. The others are alright for the most part, at least for whatever I've read so far.) :)

I've been familiar with what TDP really is for a while now, though I appreciate the thoughtfulness. :)
I'm not totally sure if I got what you meant by what I italicized in the 2nd paragraph, but if you did mean that having power consumption approaching the TDP can sometimes mean the temp. approach TjMax, then I don't really mean to offend but I don't think that's worth noting so much since I'd think it would highly vary with the cooler and cooling environment.

In the 3rd paragraph, I italicized another statement that I didn't get. (Sorry, if I seem slow. Hehe...) Did you get the "85 to 95w" figures by adding "20w" to "65-70w"? If so, why? :)

Also just how the i7's and i5's previously mentioned have the same TDP despite different clockrates goes to show the TDP isn't quite so indicative of power consumption. One thing worth noting with possibly great concern is how there was this CPU I recall that consumed more power than it's TDP indicated. IIRC, it was a Bulldozer CPU and it may have been shown in one of the TH's reviews. I don't think it was overclocked because it wouldn't have been an issue whether it went past its TDP or not. Anyway, anyone reading this should take it with a grain of salt because I don't remember the source and thus can't present it, plus my memory may have failed me. 😛

I'm not sure how binning works exactly. What I've learned from "here and there" is somewhat like this, from a silicon wafer, chips are cut out, there are chips that have "purer" silicon than others (this part may have just been an assumption on my part/my imagination 😛). They then set aside (as they see fit) some chips of a certain quality in "one" bin, and others in other bins.
Aside from the disabling of cores or components due to them being defective or not running up to spec, I've heard of some chips not undervolting as good as others can at a specific clockrate also the phenomenon of how some chips of the same kind (model) overclock better than others (I'm not sure if I've actually read this as being due to the quality of the chips or if I just assumed it.). I don't know as well if this behavior is due to some transistors being defective or if some (or most) of them just don't run as efficiently.

Anyway, I just wanted to say what I just said for some reason I'm not sure I can pinpoint. 😛
Maybe the S and T versions of the Core i CPU's can't be compared to the "standard power" versions because they may be better binned and thus maybe undervolted more, and we all know *hyperbole* how voltage and it's squared nature can affect power consumption. (I can't confirm this without researching about at least the models that are already out like SB and IB (though the way Haswell models are "done" could still be different). Since I'm reading other stuff as well, I'm feeling a bit too lazy to. Sorry. 😛) But maybe this is why those models are more expensive (I think), because of the extra hassle Intel has to go through. As was obvious though, I'm very uncertain about all that. Hehe...

Anyway, I have heard as well (and I guess seen through examples) of how TDP values can encompass chip models that are far apart in terms of power consumption. So I don't think we can really safely formulate theories using TDP values. 🙁

Thank you for that link. It was enlightening. :) I'm wondering, is reaching the Tcase what throttles down Turbo Boost with Core i5's and i7's? I know Turbo Boost dies down if a certain temperature is reached, but is it the Tcase temperature?

I and someone who previously commented above have thought of the possibility of Haswell CPU's either using "crap" paste or decent paste or even going back to using solder again. Though, if we do say the IHS (or what's under it) is the issue now as to why Haswell has a higher TDP, wouldn't that mean that this IHS would dissipate heat from the chip less effectively and thus better cooling wouldn't be able to help (the TDP is used to indicate a required level of cooling as I know). I'm not totally sure about how heat would work in this case, so I could be wrong.

Nice theory you got going there, and I bet many people including us would like Haswell to be a good overclocker. :) I myself enjoy formulating theories using given data like that, and also like reading other people's theories presented as you have. Though, too bad that only time will really tell... Here's to hoping! 😀
 
[citation][nom]ojas[/nom]Also, ALL models get the same IGP with almost the same clocks[/citation]I highly doubt performance will be the same. You know that with GPUs, clocks alone don't tell us much, right? I've heard there could be as many as three variants of IGP in Haswell, with differing numbers of execution units. Of course, with Intel, even identically named IGPs can vary significantly in performance depending on chip. For example not all HD4000 IGPs perform alike because they don't all carry the same clock rates - especially turbo clocks, and the very low power ones can't hit max turbos when you stress the CPU at the same time (such as gaming). I expect the gap from low-power to high-end chips to be even larger than the gap between HD 2500 and 4000.
 
[citation][nom]alextheblue[/nom]I highly doubt performance will be the same. You know that with GPUs, clocks alone don't tell us much, right? I've heard there could be as many as three variants of IGP in Haswell, with differing numbers of execution units. Of course, with Intel, even identically named IGPs can vary significantly in performance depending on chip. For example not all HD4000 IGPs perform alike because they don't all carry the same clock rates - especially turbo clocks, and the very low power ones can't hit max turbos when you stress the CPU at the same time (such as gaming). I expect the gap from low-power to high-end chips to be even larger than the gap between HD 2500 and 4000.[/citation]
Dude. I know, read my last long post. I've mentioned that Haswell has GT1, GT2, GT3 IGP variants. But if you look at the slide, it simply says that all chips get HD 4600 graphics, and the clock rates are almost the same.

So now are GT1, GT2 and GT3 subsets of HD 4600, or is HD4600=GT3? Knowing this will help explain the TDP thing.
 
[citation][nom]army_ant7[/nom]Lots of stuff! 😀[/citation]

Sorry i was feeling too lazy to quote para by para 😛

1) Wolfgang. You've been reading Tom's for longer than i have (just checked your join date 😛) so you'd remember Wolfgang's articles in the past. That's just decimated my image of him, possible beyond repair. I think i've only read 2 articles in the last ~2 years that i though made sense, but usually his analysis is the typical "Apple rules, ARM is the future, x86 and Windows suck and are bloated" etc. Plus he's an analyst, and i don't like analysts, simply because a majority of them seem to be more focused on spewing BS that influences the market. Zak Islam seems to be Wolfgang's pseudonym. Tom's news section is probably only still worth reading because of Jane and Catherine.

Anyway, he completely sucks at interpreting hardware news most of the time.

2) Ah sorry. Actually I've been very confused about what TDP is for a long time, and the internet hasn't helped. So i was kind of explaining and thinking out loud too, hoping you (or someone else) would correct me if i was wrong. :)

But anyway, second para i meant that, if TDP is defined as the power dissipated at TjMax, which seems to be 105*C for all processors irrespective of their lithography (probably a property of the silicon they're using, not sure), then those ULV processors hitting 15w (with a TDP of 17w) weren't really close to TjMax at all (of course, as you said that would vary with cooling, but then why is TDP defined at TjMax?), and that TDP could be a fairly good indicator of power consumption.


3rd para: My processor has a TDP of 95w. Under prime95, system power consumption goes up by around 65-70w. Since the most load is on the CPU, obviously 95% of the power increase is because of the processor. b/w 64w and 130w, i don't expect the PSU's efficiency to vary a whole lot (it's a 550w PSU after all, so this is a variation b/w 11% load and 23% load, and the efficiency curve doesn't vary all that much between these points).
I'd assume that the processor takes at least 20w to operate when idle at 2.0 GHz. So 65+20=85w at load, at least, which is close to the TDP value. Really an extension of the point in the first and second para. Though it's worth noting that the entire "standard power" Core 2 Quad family has a TDP of 95w, even those monsters clocked in excess of 3 GHz, and i suppose they'll consume quite a bit more power (a 4% OC on mine was showing about 2w more), probably almost hitting their TDP.

BTW, i just remembered, SiSoft Sandra reports my CPU's power consumption to be 142w at load and about 45w at idle, i've no clue how it pulls out those numbers.

Bulldozer...i'm not sure about that, because CPU power consumption numbers are very rarely reported separately, it's usually total system power consumption that reviewers tend to list. But you might be right because i used to think that TDP was an indicator of average power consumed by the CPU, and now that i'm thinking about it, i do remember having a conversation on the forums about TDP when the Bulldozer articles went live. Yeah i think you're right really. There was something like that. I remember the discussion going like "Intel states max possible power consumption but maybe AMD only states average power" or something like that. Yes.

I pulled the Phenom II X4, Core i7-920, and Core i5-2500K runs off of this graph because they cluttered it up way too much. The three chips left are, in my opinion, the most relevant.

The black line corresponds to Intel’s 95 W Core i7-2600K, which averages 155 W system power use throughout a complete run of PCMark 7. Before you mention that the Core i5-2500K is closer, price-wise, to the FX-8150, know that it averages just two watts less than the -2600K, at 153 W across the entire run. Imagine that its plot would look almost identical.

The FX-8150, in comparison, averages 191 W. That 34 W delta almost exactly correlates to the 30 W separating Intel’s 95 W rating and AMD’s 125 W TDP. Even more interestingly, the Phenom II X6 1100T hits the same 191 W system average across PCMark 7. Meanwhile, the Phenom II X4 980 averages 184 W.

Intel’s Core i7-920 stands out as the one model to use more power than AMD’s new flagship. A 193 W average consumption number is 2 W higher, which we’d consider reasonable given a 5 W-higher TDP.
http://www.tomshardware.com/reviews/fx-8150-zambezi-bulldozer-990fx,3043-22.html

There's another article about efficiency. I didn't try finding the comments i was looking for on that article because the comments section is 27 pages long! Too much work 😀

3) My knowledge of binning is from "here and there" too 😀
But yeah your points make sense regarding under-volting. I think the thing is that a circuit can only sustain a certain frequency and if that frequency is too high or too low then you face a problem. Increasing voltage probably helps in biasing and all (i need to study a bit more regularly, I'm in an electronics engineering course in college :lol: Though in my defense we've only studied very basic stuff and CPU architectures are still a year away!) and stabilizing the circuit, conversely undervolting would make the circuit less stable unless clock speeds are dropped. This i believe varies a lot with transistor design and nature of materials used (for example the base-emitter junction will have a potential diff of 0.7v for a silicon BJT and a different value for a Gallium transistor (which i don't remember!); but then there are tri-gate transistors being used here and i don't really know how they work). If you knew all this then do forgive me for rambling on like this 😀

but yeah i think purer the silicon, the more tolerant it is to over- and under-volting and clock speed changes. And yeah binning is pretty much what you said afaik. Though what i meant was that i doubt that slightly defective or impure silicon or improperly formed chip parts that are deemed "good enough" but not perfect would really change the power consumption figure in any significant way. If they would, i think Intel would simply disable those parts.

Also, yes from what i've read so far in school/college is that Heat dissipated Power*time= VIt =(I^2)*R*t = [(V^2)/R]*t.

So naturally heat and power are non-linearly related to voltage, and so your point should be perfectly valid, lower the voltage and you get much less power consumption.

4) I think turbo boost limits ARE set for Tcase, looking at that Intel link. What i believe is that Tcase is the temperature at which Tj = TjMax, or at least close to it. I'm not sure. They say that they measure TjMax for mobile chips since they don't have an IHS, but for desktop parts they rather measure the IHS temperature.

So obviously there's some relation b/w Tj and Tcase, but i don't think they're equatable because i'd suppose Tj>Tcase since i doubt the TIM b/w the IHS and the "junction" will be 100% efficient, and you can't have a perfect heat sink anyway.

But since they don't monitor Tj for desktop parts (or do they? I can't say, maybe it's not revealed to the BIOS)...wait. I just confused myself. If Tj is visible to the CPU but not to the BIOS, the answer to this Turbo question can only be decided if we know which part is responsible for controlling Turbo Boost, the motherboard or the CPU itself. If it's the motherboard, then Turbo should be controlled by Tcase. If it's the CPU, it should be some percentage of TjMax. But the Turbo behaviour is usually set by the BIOS, so i'm not sure at all.

Looking at my experience with the ULV chips, i think that in the case of mobile chips at least, it's some percentage of TjMax. I don't have the CPUz or Core Temp screenshots/csv files anymore, otherwise would have checked what was happening back then.

If you have a SB/IB CPU then maybe you could check what happens to turbo boost when the reported temperature reaches

5) The paste/solder thing. Since TDP in the case of desktop chips is the max heat the IHS diode should be exposed to (assuming TDP is defined here at Tcase), it's the heat that the IHS can handle (and thus it's the heat, i.e. power dissipation every second, that a cooler would have to handle to keep the IHS temp under Tcase). Now from what i understand is that the better the TIM under the IHS, the more quickly the IHS temp will reach Tcase.

So with Ivy Bridge, using paste instead of solder slows the heat transfer from the cores to the IHS, so while Tj remains higher (but presumably less than TjMax), Tsink (i made this up for the IHS temp at any given moment, to differentiate it from Tcase which is the safe limit) remains lower, meaning that the cooler has to work less to maintain a specific Tsink temperature.

So if they used solder, they'd have a lower Tj but a higher Tsink, meaning that they might have had to increase the TDP, since their cooler division would manufacture coolers accordingly.

Now in haswell's case, i'm assuming that they've also increased the TDP because they're reverting to solder, meaning that they'll be able to keep Tj lower while increasing Tsink, thus they'll have to raise Tcase in the process, since it'll heat up faster.

So the higher TDP should actually mean that IHS is pulling more heat away from the cores, but then it also needs to be cooled more effectively, since it's not a perfect heat sink.

CPU cooling is a story of heat sinks: the TIM b/w the cores and the IHS, the IHS, the part of the cooler that pulls heat from the IHS (helped by thermal paste, which is another sink) and the fins of the cooler that dissipate heat into air (which is also a sink with respect to the copper heat pipes and plate that makes contact with the paste), and air is of course the last sink, which is almost a perfect heat sink as long as it keeps flowing (and you get more fresh air around the fins).

Obviously if the first stage is crap then the second (the IHS) cant do too much about it. In the case of Ivy, i think that the first stage was made a (deliberate?) bottleneck so that they could lower the TDP and Tcase.

My entire theory right now depends on the Tcase set for Haswell, and of course more info on the mysterious HD 4600 graphics.

6) Yes speculation is immense fun, and the unfortunate wait is unsettling! Also, for the first time i actually know enough to speculate on stuff like this (now that i can somewhat understand what Chris and Anand write when they discuss CPU archs, earlier it used to go over my head and induce a headache :lol:), though i'm not sure if i know enough to be right! Which is like this personal challenge i'm giving to myself. 😀

BTW you're one of the politest people i've met here on Tom's! *respect* :)
 
@ojas
1) Hm... I might've not been paying much attention then... I don't think I've ever felt negatively towards Wolfgang or at least so much that it would be notable... I haven't been reading news articles as much as I used to a year ago as well though... With Zak Islam though, it's just that some of his articles felt like they were copy-pasted. Then there's the case of contradictory info with in the same article. It's like he doesn't put to much thought in them. I also felt that it's like he doesn't seem to know much about what he's talking about. But that's just me and my thoughts, and others should decide what is what is not based on what they see from his articles. There were numerous occasions that I've noticed these, and that's why it's so notable for me. Also, I prefer how the others put more life into the articles, like giving their thoughts and insights. I think Wolfgang does this like the others. Well, maybe I'll eventually understand what you guys mean...

2) Hm... I believe TDP just means the amount of heat released by a chip based on how much power it consumes, and thus how much cooling you'd need. At least that's what I got from Wikipedia. I also thing TjMax is independent from your TDP, as it's just the max temp that a chip can handle before saving itself from permanent damage. So let's say you remove your cooler, you might hit your TjMax even if your CPU isn't so busy. :) Just curious, where did you see TDP being "defined at TjMax"? Just curious because for all I know, what I've known thus far could be wrong. Hm... Were you referring to how some people say that for example, a CPU with a higher TDP might be able to use Turbo more? I wonder how much truth there is to that really, or what it is so.
I have seen CPU's with TjMax'es aside from 105C. This Atom for example has 100C as it's TjMax. I think the Atom N570 I use has 90C according to a temp program from TechPowerUp IIRC.

About adding your assumed idle power of 20W to the load power of 65-70W, I'm not sure if it really works that way. I'm thinking it might be similar to cars. Remember when you put a car into ignition, but you remain parked? It burns gas doing nothing (since it isn't moving). I think it does that just to remain "ignited" so that when you do drive it, it would be ready and burn more gas. Though it might not be the best example since chips and cars don't work the same way AFAIK, idle power may just be a result of power flowing through your CPU and other components, also doing some really small background tasks. I'm really not sure what a CPU and other components (aside from fans and other moving parts) do with that idle power exactly. Like where it goes... But we have an idea where it starts going when the CPU finally has some work to do, plus more power that's needed. Again, I wish I knew how things really work, but I'll hopefully learn that while I'm taking my Bachelor's in Com. Eng.
So yeah, I don't think you really add idle power to what power gets consumed at load, because that which used to be idle power may be already part of whatever power's used at load. :)
Also, I remember you mentioning that you have the power saving feature(s) turned on? As I know, those features reduce clockspeed when the workload isn't so much, but also undervolt your CPU, so that would affect the power consumption at idle compared to at full load in a non-linear manner I believe.
I hope that isn't true about AMD using average power as the basis for TDP.

3) What you've said about frequency and voltage does agree with what I know about the topic. And no, I didn't know about those more technical details (though sorry to say, what you said is a little bit too advanced for me right now). Hehe... I hope to gain deeper knowledge of them in college though. 😀

4) I'm pretty sure, based on what I read from the link from Intel you shared, that Tcase and TjMax are two different ratings. The way Tcase is explained makes me think it's based on the temp of the CPU as a whole, also that it's just the temperature the CPU shouldn't reach so it doesn't degrade (wear out its lifetime) too fast (sort of like a (highly) recommended temperature), which makes me think Turbo Boost is based on it in a way that when the CPU is approaching the Tcase, it throttles the core(s) frequency down.
And what I understood from TjMax is that it might be per core, also that when it's reached, the CPU shuts itself off to save itself. I'm thinking it might be per core because what if in a quad-core CPU, the other 3 cores are "sleeping" but there's this single-threaded program (like Prime95 with 1 "worker" I think) working that one core so much, and then something was wrong with the cooling that that 1 core was overheating. I don't think the CPU can afford 1 core to be permanently damaged, so I would think there would be one TjMax digital thermal sensor per core.

But yeah, that point of yours about the IHS (which I assume to be the heat spreader mentioned in the Intel link) possibly not "feeling" as much heat as the CPU cores do, and the Tcase sensor supposedly being on the IHS. *sigh* I do find your thoughts to be logical and share you uncertainty unfortunately (because I'm not much of a help to either of us this way). *sigh* I do have an SB, but sadly it's an i3, and thus has no Turbo Boost. 🙁

5) I'm not really sure what you mean by TDP being defined at Tcase, unless you're implying how resistance is higher at higher temps (which I think is true based on what I can remember from school) and thus more power is turned into heat.

You may have more knowledge about how heat works. It's also something important to understand for this topic of ours. This may sound stupid, but, does heat accumulate infinitely? Let's say, you have an indestructible CPU that continuously releases heat, and hypothetically, that heat can't dissipate to anywhere, not ever the air (let's say it's in a vacuum), and let's take out radiated heat out of the equation. Would the CPU just get hotter and hotter in an infinite manner or will it reach a certain equilibrium and stay at a certain temperature?
Even though it sounds like it would obviously keep on accumulating since you're bring more and more power in and thus generating more heat, Physics can be tricky sometimes, and I'd rather not have any misconceptions based on assumptions. (Just like how some may assume that heavier objects fall faster, without taking into account wind resistance.) 😛

Another thing to consider is how the heat conductivity of specific materials work. Like is it linear, by percent, quadratic, etc? How hot would a certain piece of metal get (and thus conduct) from a 1,000K object if it gets as hot as 450K from a 500K object assuming both of these heat sources manage to constantly stay at their temps?(I'm using the Kelvin scale because it's the absolute scale and operations other than addition and subtraction shouldn't be done on Celsius and Fahrenheit IIRC, for those who are wondering.)
Actually, these questions might be wrong since conduction might actually be a rate rather than an absolute limit.
Ugh! Dang it! I wish I knew the answers to all of these so I could make better speculations. I remember how I didn't quite get the example I saw in my education about why water (like in a beach) stays cool amidst the heat of the sun.


I appreciate the compliment BTW. I try to be... It makes conversations more pleasant and "efficient." You aren't bad yourself. :)
 
I also thing TjMax is independent from your TDP, as it's just the max temp that a chip can handle before saving itself from permanent damage. ..

Transistor resistancy can vary with temperature. And so it happens that stable overclock at 50°c isnt that stable anymore at 105°c, meaning you need more voltage, meaning more heat... it's a vicious circle. Here comes undervolting into play, a given frequency can be stable at 1,1V at 50°C, but needs 1,15V at 70°C+ or lower frequency. CPU's from good yield can be undervolted quite a bit for stock freq. or overclocked for stock voltage
 
I did take note of how resistance increases with heat somewhere in that massive post of mine. 😛

With that phenomenon you explained, yeah, I know what you mean... When I was setting different undervolted voltages for the different P-states of an Athlon 64, a concern of mine was what if from running at full load for a while (enough to get it hot "enough") and then the CPU drops to a lower P-state with a lower voltage (that I got from stress testing just at whatever (lower) clock rate that P-state is thus not having as high a temp during that stress testing and thus not having as much resistance). I feared that if that situation happened, then a BSOD might happen (i.e. an unstable system).

I hope you got what I was saying. Just sharing my own experience with that phenomenon.

With overvolted overclocking, what's done is they set enough voltage to remain stable at the max temp, taking into account the added temp from the overvolt itself right? Anyway, that "vicious circle" you described shows how having good cooling can be very effective in terms of overclocking. It helps avoid higher temps, thus the need to have higher voltages which cause higher temps. :)

 
1) Zak should just be fired. lol.

2)
intel_ivb_10w-665x435.jpg


Read the footer. TjMax is independent of TDP, but the converse doesn't seem to be true, at least according to the slide.

Hmmm i guess it's to do with chip construction then (Tj) or something else. I don't know i can't speculate now, it's beyond me 😀

Ah. See about the power consumption thingy. See you're right in what you're saying, but what i'm doing here is a bit different.

I'm taking the difference of total system power. This i'm equating to the additional power used by the CPU when under load. In you car example, assume the stationary car uses x liters of fuel. when it's in motion, it uses y liters. y-x would be the additional fuel used for movement.

So y would include x, yes. But y-x would not! 😀

So here, in the cpu example, if x=64, y=130, y-x=66. This is exclusive of x.

However x and y both represent total system power. x includes the rest of the system components as well as the CPU's power consumption while idle. So when you subtract x from y, you're subtracting that initial idle power and the rest of the components' power from y. Now you have to know what part of x is the CPU's share. I don't know any way to calculate that without pulling out the CPU. So i'm making a rough estimate of 20W (reasonable, i should say?).

(BTW this 20w is exactly what you're talking about, that ignition fuel consumption, since after all even when it's 'idle' it's still keeping the OS and everything else up and running).

So finally i'm saying:
CPU power at load= (CPU component of x) + (y-x)

I'm not spectacular at maths but unless i'm doing something very, very wrong here i believe this is correct. 😀

3) lol it confuses the hell out of me even today, so don't worry 😀

4) Yup i think there is more than one Tj sensor per core, that's why there are separate readings for each core if you use Core Temp or RealTemp.

Tcase...at least from that link, all they say is that it's the max temp the temperature sensor on the IHS (integrated heat spreader, the metal cap you see on the cpu chip) should be subject to, and also separately they say that it's the max temp the processor should be subject to...
To allow optimal system operation and long-term reliability, the processor must not exceed the maximum case temperature specifications as defined by the applicable thermal profile

TCASE is the temperature measurement using a thermocouple embedded in the center of the heat spreader. This initial measurement is done at the factory. Post-manufacturing, TCASE is is calibrated by the BIOS, through a reading delivered by a diode between and below the cores.

...

TCASE Max is the maximum temperature that the TCASE sensor should reach. Both TCASE and the thermal specification information can be found on the Intel web site.

(i just realised there's a TCaseMax too, so in my earlier post Tsink=Tcase and Tcase=Tcase max, since i thought Tcase was the max tep the thermocouple should reach)

Now the BIOS calibrates it, so it has some relation with Tj, which can't be 1:1 because of thermodynamic laws (basically heat flows in a gradient depending on the temperature difference at the two ends, till the two ends have the same temperature, at which point there's equilibrium).

About Tj, they say:
Tjunction is synonymous with core temperatures, and calculated based on the output from the Digital Thermal Sensor (DTS) using the formula Tjunction = (Tjunction Max – DTS output).

...

Tjunction Max is the maximum temperature the cores can reach before thermal throttling is activated. Thermal throttling happens when the processor exceeds the maximum temperature. The processor shuts itself off in order to prevent permanent damage.

...

Mobile processors do not have a integrated heat spreader like desktop processors. This is the reason why the mobile thermal specification refers to Tjunction Max instead of TCASE Max.

5) That footer on that slide indicated that TDP was defined at TjMax. Now if desktop processors use Tcase Max as well, is the TDP for desktop CPUs defined at Tcase Max? That's what i meant. This also makes sense if you consider that Wiki definition you referred to, about the amount of cooling you'd need, since the CPU cooler technically keeps the IHS cool.

About the heat thing. Well. Ok see that's a bit tricky. You're not giving the heat a sink and providing energy infinitely, so you'd probably end up changing the material characteristics, or it won't accept any more energy. But then you're providing it electricity, so you've not isolated the system completely, so it'll leak energy via those paths.

You get what i'm saying i hope? 😀 A completely isolated system won't leak energy, but it can't accept energy either.

And heat only flows if you have some sort of heat difference. So if the IHS temperature would be equal to the core temperature, the entire system would be in thermal equilibrium and heat can't flow away from the heatsink. Your indestructible CPU would either undergo a physio-chemical reaction or leak energy via the paths it's getting the energy from, assuming it doesn't shut itself down.

That's really all i can say 😀

See there's a "heat equation", it's non-linear and iirc exponential...
https://en.wikipedia.org/wiki/Heat_equation

The first line merely says parabolic, so at least it's non-linear!

Anyway, without reading that link, and from what i know, heat flows at a rate that's dependent on the thermal gradient, or the difference between the two objects. So the transfer from 450K to 500K at this point (when their temps are this much) would be far slower when the 450K thing is exposed (assume by conduction) to the 1000K thing.

Heat transfer slows till both objects are nearly the same temperature, after which the rate of heat emission equals that of absorption, and you have thermal equilibrium.

I hope i've been clear enough, i tend to jump between things as they enter my head (like link hopping on Wikipedia 😀).
 
@army_ant7: Though i've got a downvote for some reason, i hope it's been helpful, unless you've been the one who's downvoted it, in which case i'd be happy to correct whatever stuff i've got wrong 😀

But yeah read some more interesting stuff, will post in a day or so (extremely long, have exams going on 😀).

Basically a processor's power output = CxFx(V^2), where
C= capacitance
F= Frequency
V= Voltage
 
@ojas
I have no reason to downvote you at all. Maybe it was just something you said that someone didn't like. (For all we know, it could be Zak because of what you said in the very first sentence. :lol:)
Sorry to say that I've been neglecting to read your post because I'm waiting for myself to get into a reading mood. Don't worry though. I've kept this open in a tab. 😀

I was aware of the formula. Saw it on Wikipedia a while back. :) Thanks though for sharing. Again, it's thoughtful and can enlighten those who may come across that post.
 
Never upgrade from a generation to another generation , increases in performance are always 10-15% of the old generation .

"The average performance increase, according to IXBT Labs and Semi Accurate as well as many other benchmarking sites, at clock to clock is 11.3% compared to the Nehalem Generation, which includes Bloomfield, Clarkdale, and Lynnfield processors"

[Ivy] "Compared to Sandy Bridge: 5% to 15% increase in CPU performance "

[Haswell] "Compared to Ivy Bridge (expected): At least 10% CPU performance increase."

So i`m looking at a maximum of 36.3% increase in performance ... over a span of 2 years.
 
Never upgrade from a generation to another generation , increases in performance are always 10-15% of the old generation .
yeah well, some of us are using computers for something else besides internet and gaming. And if you sell your "intel tock" cpu and buy similar "tick" cpu, it's your fault. every tock since first core arhitecture is worth considering
 
[citation][nom]executor2[/nom]Never upgrade from a generation to another generation , increases in performance are always 10-15% of the old generation . "The average performance increase, according to IXBT Labs and Semi Accurate as well as many other benchmarking sites, at clock to clock is 11.3% compared to the Nehalem Generation, which includes Bloomfield, Clarkdale, and Lynnfield processors"[Ivy] "Compared to Sandy Bridge: 5% to 15% increase in CPU performance "[Haswell] "Compared to Ivy Bridge (expected): At least 10% CPU performance increase."So i`m looking at a maximum of 36.3% increase in performance ... over a span of 2 years.[/citation]

You're making a huge over-generalization and coming to an inaccurate conclusion as a result of that over-generalization.

First off, for the last several years, performance increases per tock generation have mostly been significant. Even between ticks, improvements could be significant, at least in overclocking potential. Ivy Bridge and (possibly) Haswell are only the first two in a long time to stop this trend. For Ivy, that's only because of the crap thermal paste between the CPU die and IHS, which can be switched out for top-notch paste to get significant improvements over Sandy Bridge in overclocking performance if you're willing to do it or can get someone else to do it for you. For Haswell, we don't know what the improvements will be. Sure, we are told that stock performance won't be increased much compared to Ivy, (as you said, around 10% is expected) but that doesn't mean that overclocking won't take a good leap.

Even Ivy can manage something like a more than 20% gain over Sandy in overclocking if you switch out the paste (which, honestly, isn't difficult, although it is time-consuming and somewhat tedious) and if Haswell manages anything like that, the improvement since Sandy could reach for and possibly beyond 50% from Intel for overclocking *enthusiasts*. That's not bad and software improvements in well-threaded programs could make even greater differences thanks to the four and more threads of even most lower mid-ranged CPUs such as the Intel i3s and AMD FX-4xxx CPUs getting more and more utilized.

Also, your math is wrong. Not only do percentages not add like that, but you're going by per clock improvements instead of true performance improvements. If you even went with your somewhat flawed data, it'd be an ~40.8% improvement at maximum which in fact it is more than that coming from the original Nehalem CPUs at comparable price points because Sandy, compared to Nehalem/Westmere, increased clock frequency in most models in addition to performance per clock, dropping power consumption, and doing even more in performance enhancements.

Last, but not least, upgrading once every generation can in fact make sense for many people. I usually don't do it for my own computers, but many people do and they do so for good reasons. For example, anyone who has income that depends on the performance of a computer would probably upgrade as soon and often as reasonably possible. Even for regular people, upgrading by selling your previous components and buying new ones at the right price can make sense. Play your cards right and you can make a little money each time while getting a decent performance boost and/or power consumption reduction. Regardless, there can be reasons to upgrade each generation and Intel's generational improvements actually usually are in excess of 10-15%, at least in Intel's tocks.
 
Status
Not open for further replies.