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Are the Honeywell PTM7950 phase change pads better than paste for direct die applications (say for a GPU to a heatsink and/or vapour chamber)?
The marketing blurb from Honeywell states:
PTM7950 is a Phase Change Pad with a Thermal Impedance of 0.04 - 0.08 (OC cm²/w), Thermal Conductivity of 8.5 (w/mk)
The thermal conductivity quoted doesn't seem that impressive to me.