Top mounting is still the most common option though, and radiators placed there usually work best with the fans underneath, blowing upward.
1. This goes against CLC manufacturer's written instructions, the laws of thermodynamics and common sense. I understand the thought process, we all learned in 8th grade Earth Science that hot air rises so lets push air up. Earth Science did not include ceiling fans. Air rises because warm air is a fraction of a % lighter and it does so slowly in the temperature range in question. This force pales in comparison when mechanical force is involved as is evident to anyone who has ever sat below a ceiling fan.
2. Now onto thermodynamics. The effectiveness of a cooling system is directly proportional to Delta T. Example:
Ambient Air = 23C
Coolant Air = 33C
Interior Case Air = 28C
Using Ambient Air as Intake, cooling is proportional to: Air flow x (33C - 23C) or 10Q
Using Case Air as Intake, cooling is proportional to: Air flow x (33C - 28C) or 5Q
It is therefore an inescapable conclusion that using outside ambient air is twice as effective than inside case air in this example. No matter what the temperatures are, ambient air will always be cooler than interior case air. You are talking about buying a CPU cooler in this article ... not a MoBo cooler, not a SSD cooler, not a HD cooler ... why ? because these things do not need cooling and are not impacted in any way in the temperature range in question.
The only item that can be impacted in GFX cards and testing with non-reference cards shows no evidence of that occurring ... well except of you use blower style coolers. When sizing a radiator, the calculation methods "that work" use a factor of 60% of theoretical load. part of that is due to the fact that not everything is at peak load at the same time .... the other part of that is is that everything is radiating heat off its surfaces.
Concerns about graphics card heat being ejected through the top-panel radiator have been addressed in my own builds by using graphics cards that expel most of their heat through a rear-panel expansion slot, as seen in the silver card above. Yet graphics card reviewers frequently recommend dual-fan or triple-fan cards such as the black card above, focusing entirely on the improved graphics temperature-to-noise ratio without any concern for the impact that waste heat has on every component above the graphics card. Because I review both cases and CPU coolers, I consider graphics coolers that blow heat into the case to be defective.
The correct word is "effective". First off, look at GFX cards reviews and blower style coolers always leave their cards running hotter, then the normal style. Second, no card cooler exhaust hot air exclusively in or outside the case. No matter the cooler style, some heat is conveyed internally and some externally ... blower style cooler simply send more out than conventional coolers ... and pay a thermal price for doing so as they can move less air out thru those little tiny openings.
Add a fog machine to your test bench and you will see immediately that the situation you describe simply never happens. Those 3 fans on those GFX cards are bot blowing air up.... with the rad ran set as intakes, they are blowing down. So if you installed your radiator properly, "graphics card heat being ejected through the top-panel radiator" never happens. The fog machine does show what is happening .... all air is exiting thru the grilles or fan on the rear of the case ... none of it is coming back in. You "created" the perceived need for a blower style cooler by improperly setting up the rad fans as exhaust.
3. Today's non-reference GFX cards (well nVidia anyway) have little to gain from water cooling other than noise reduction. Now most folks build there box with a CPU cooler ... and no thought to adding a cooler to anything else. So if there was no concern here, why the sudden concern about what 28C radiator exhaust air will have in your components ? Reviews of the cards like the Gigabyte G1. MSI Gaming etc, show no evidence of thermal throttling even at the highest OCs. What component is it exactly that we are trying to protect here ? We have 6 thermal sensors connected to a digital display in a 5.25" bay and an infrared thermometer. Can't seem to find this issue of components being heated up to a point of concern. Mobo, storage sensors report everything in low to mid 30s
4. The other factor being overlooked is case air turnover. When you move to liquid cooling, you change the case air turnover. With an air cooler, you basically move the air from the CPU to the case interior, leaving the case fans to take it from there. When you add a liquid cooler, you have the exact same condition. Is every air cooler out there leaving every case in a deficient condition ?
People rarely think about one of the most important cooling features of their case, the rear grille. When you take your typical 2 fans blowing in, 1 fan blowing out case setup, and add a 2 x 140mm radiator, you are greatly increasing case air turn over. Now fresh air is coming in at a much greater flow rate so the condition of the air inside the case is much cooler than it was with the air cooler.
Conversely, when ya add that top radiator blowing out .... you have 3 fans blowing out and two blowing in ... and those 2 are restricted by air inlet filters. With well more than twice the air blowing out as in, you now have a) dust coming in thru the rear case grille, b) your hot PSU exhaust is coming in with it and c) all that hot air from your "blower style" GFX card(s) is coming right back into the case. Again, this becomes readily evident when using a fog machine.
Some of our test have even shown these massive coolers outpacing a few of their liquid rivals.
In almost every case I have seen, the better air coolers outperform their CLC rivals, when compared "apples and apples" (noise and cost equalized) it's not even close. CLCs need to make up for the weak pumps and aluminum rads buy using extreme rpm fans which result in excessive noise ratios.

The H100i loses by 3C while being 12 times louder. The X61 wins by 1C wile being more than 8 times louder. And both cost substantially more.
No arguments here against shipping a PC w/o a large air cooler inadequately secured .... but shipping a water cooled system is not without risk either. But in a article entitled "How to Choose a CPU Cooler", it's going to apply more to those building a box as opposed to ordering one as the system assembler has few options. But yes, if handled abusively, the risk of damaging a PC being shipped exists. My son's made it back and forth to college 4 times a year with his PC (2 lb cooler) in the rear deck or on the roof rack of his off-road jeep whose suspension resulted in quite a rough ride.
Custom loop cooling will always outperform air on any level, with properly select components, other than price. CLCs on the other hand, just about all suffer from inherent weaknesses whereby:
a) almost all can't match their comparably priced air coolers
b) almost all are limited by weak pumps and aluminum radiators
c) almost all create excessive noise levels, the ones that don't suffer thermally from weaknesses of a) and b)