Does anyone know the formal definition of TJMax? Is it just the hottest point at the interface between the die and IHS, or is there some minimum area specified, as well?
The reason I ask is that...
Intel increasing TJmax is a good thing. It means they have confidence in their new silicon being capable of operating at higher temps.
First of all, you have a point that they wouldn't do this if the process node couldn't handle it. However, I view it as less of a harmless "vote of confidence" in their new process node, and more of a necessity. My reasoning is illustrated by your next point.
It doesn’t mean that it will operate at higher temps – not at stock clocks at least. Previous gens like the 3rd gen (3770K) had TJmax of 105C. They didn’t run hot at stock, did they?
Ivy Bridge did actually run hotter die temperatures than Sandybridge. Part of that was their unfortunate decision to replace solder with thermal paste, between the die and IHS. Another part of it was due to the size reduction of Ivy Bridge's cores. Smaller cores need to have proportionately smaller TDPs, or else the amount of thermal energy per unit of area goes up.
The era of constant thermal density ended approximately in 2006, so it's a given that a lithographic shrink of effectively the same microarchitecture would run at higher thermal density. And that can result in hotspots that are more difficult to cool.
This is one reason Zen 4 is thought to run rather hot, in fact - the thermal density with TSMC's N5 node is quite high. So, given these CPUs' use of Intel's 20A node (and 18A, for Panther Lake?), it seems to me like it might be more of a
necessity to tolerate higher TJMax temperatures.