News Intel CEO Gelsinger says China is ten years behind in chipmaking capabilities, and it will stay that way

Page 2 - Seeking answers? Join the Tom's Hardware community: where nearly two million members share solutions and discuss the latest tech.
Status
Not open for further replies.
Parity? How so? While the west moves on to High-NA EUV. Has China even begun the process of reproducing all of the pre-requisite upstream industries that are being sanctioned? No company on earth has been able to match ASML's equipment, but you think not only will China be able to catch up to current ASML machines, but to match TSMC's adoption of High-NA EUV? Do you have any idea how monumental of an undertaking this is?

You and most commenters here are missing the key point. While it was certainly a (slim) possibility that pre-sanction China could catch up to Intel and TSMC by 2030, they now have to also build out an entire domestic upstream industry before they can even begin to attempt this.

Are you really suggesting that China will have mass produced GAAFET, BSPD 200MTR+ chips within the next few years??
Ontop of that, almost all of China's money making schemes aren't producing( belt and road for instance). The only valid argument might be the number of tech grads going back to China. The problem is, innovation can't happen. There is so much corruption that any money is spent on stealing current tech and slapping a made in China sticker on it.
 
This is the same China that graduates 1.4 million engineers every year - this compared to the United States' 200,000 or so.

Oh and let's not forget the fact that many of those engineers will actually find their way into industrial/engineering jobs after finishing university, due to China's enormous manufacturing base - as opposed to, say, joining an investment bank or tech publication, as in the case of those engineers graduating in Western service-based economies.

Even taking Gelsigner's 10 year figure at face value, I wouldn't be surprised if China was able to achieve parity with the West by 2030, at least.
Parody in what? YMTC in China produces a 232-layer QLC 3D NAND die from YMTC that was discovered in the ZhiTai Ti600 1TB SSD, launched in July 2023. That's not behind. That's ahead. BTW narrow gated chips are only 5% of the global market for chips and China has focused on the other 95% and is now 60 to 70% self sufficient. If anything, the west is falling years behind China. [my more elaborate post on this issue is below in the xenophobic free zone]
 
Status
Not open for further replies.