Okay, some Questions :
1- Are we expecting an AMD APU with onboard HBM2 Memory as shared memory for both System and GPU and no DIMMs slots any time sooner? That would fit in a very small box 1/4 the Area of the Mini-ITX case. for example : 16GB of HBM2 Memory ?
2- Why dont you introduce a new form factor to the Market ? Mini ITX needs to have 2 slots for 2 GPU systems while still short (170mm) and not long like the Micro ATX (245mm) and .. in short (3 slots motherboard for 2GPU and still compact 170mm length)
3- Why dont you manufacture AMD motherboards ?
4- What are your plans for very low voltage CPU ? The Ryzen managed a good 65 watts for 8 cores .. can we expect a 15 Watt 4 cores Ryzen APU to compete with Intel low voltage CPU ?
5- Why did you choose to go dual channel memory and not quad or eight channels for the Ryzen ?
6- the same goes for the PCIe lanes , why just 16 lanes while the server CPU can reach up to 128 lanes ? and the competing Intel i7 X99 CPU offers upto 40 lanes ...
7- I have this Idea , When you Design the CPU , why dont you space out the components a little bit inside the cpu so that the cpu has more surface Area and hence better cooling ? When I look at the CPU , no matter the die shrink , the "spacing" design is the same .. why dont you take advantage of the better process to space between the components internally giving you better cooling potential and bigger surface area for cooling ? I understand the need of smaller CPU Area inside phones and compact machines , but for the desktop we have the space for a big CPU... so why dont we take advantage of the smaller process by keeping the same old bigger area and space out the cpu Areas internally?
Thats all , Thanks.
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