News Laptop ODM Wistron 'Hinge Auto-Extension' Dynamic airflow concept aims to increase gaming laptop cooling performance with displaced external heat m...

[Admin]

Taiwan's Wistron has revealed its new Dynamic Airflow system, based on the concept of a Hinge Auto-Extension, in a series of laptop renders. In summary, the images show that when a user opens up a clamshell laptop the rear 'shelf' heat module gets extended to boost airflow.

Laptop ODM Wistron 'Hinge Auto-Extension' Dynamic airflow concept aims to increase gaming laptop cooling performance with displaced external heat m... : Read more

 

[Notton]

So if I'm to understand how this works, when the screen is opened, the mobo, heatsink, and fans are pulled backwards to improve air intake?
Is it like a server rack on sleds that you pull out slightly?

I guess having the keyboard and trackpad slide forward wasn't as good?

 

[M0rtis]

So if I'm to understand how this works, when the screen is opened, the mobo, heatsink, and fans are pulled backwards to improve air intake?
Is it like a server rack on sleds that you pull out slightly?

I guess having the keyboard and trackpad slide forward wasn't as good?

To me it looks like the rear bracket/cover just slides outwards when the hinge is activated to uncover the mesh section. I guess it just removes any exhaust bottlenecks vs if the mesh area wasnt available. I dont think any of the computing hardware slides anywhere. At most the IO panel is on a separate board and connected by ribbon cable if the IO is present at the back.

 

[dmitche31958]

To me it looks like the rear bracket/cover just slides outwards when the hinge is activated to uncover the mesh section. I guess it just removes any exhaust bottlenecks vs if the mesh area wasnt available. I dont think any of the computing hardware slides anywhere. At most the IO panel is on a separate board and connected by ribbon cable if the IO is present at the back.

I agree. Moving connections doesn't sound like a plan for success. Nobody would disagree that this would be another point of failure. Enough said.

 

[Notton]

To me it looks like the rear bracket/cover just slides outwards when the hinge is activated to uncover the mesh section. I guess it just removes any exhaust bottlenecks vs if the mesh area wasnt available. I dont think any of the computing hardware slides anywhere. At most the IO panel is on a separate board and connected by ribbon cable if the IO is present at the back.

Okay, but if that were true why is there a total lack of ports on the side?
All the ports are on the back, and the rear section slides out. So this means either the mobo tray moves with those rear ports, or those ports use a cable that has to flex often. The power connector is sitting on the back, and that's usually not a flexible internal cable for laptops, if it were connected to a daughter board.

If the ports slide out, why would this be enough to win an innovative design award?

 

[nameless0ne]

From what I've gathered from the article - the only thing they've actually designed is the hinge. They call the extended part the "heat module". Some gaming laptops have their heatsinks in that place. But it is likely that did not design the actual "heat module." The article states that only renders were provided.
So all of this is just like a concept car without an engine and drive train. Just an idea that requires a lot of additional work to implement.
And as some have mentioned - more moving parts = more points of failure. This will likely never come to fruition.