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Corporate R&D
Publications in 1967 and 1968 by Feldman, Eastman, & Katzoff first discussed applications of heat pipes to areas outside of government concern and that did not fall under the high temperature classification such as; air conditioning, engine cooling, and electronics cooling. These papers also made the first mentions of flexible, arterial, and flat plate heat pipes. 1969 publications introduced the concepts of the rotational heat pipe with its applications to turbine blade cooling and the first discussions of heat pipe applications to cryogenic processes.
Starting in the 1980s Sony began incorporating heat pipes into the cooling schemes for some of its commercial electronic products in place of both forced convection and passive finned heat sinks. Initially they were used in tuners & amplifiers, soon spreading to other high heat flux electronics applications. During the late 1990s increasingly hot microcomputer CPUs spurred a threefold increase in the number of U.S. heat pipe patent applications. As heat pipes transferred from a specialized industrial heat transfer component to a consumer commodity most development and production moved from the U.S. to Asia. Modern CPU heat pipes are typically made from copper and use water as the working fluid.