This will likely be rendered obsolete as soon as air cooler and waterblock makers catch up with the changes in CPU package hot spots.
While their adjustable mount may work now, as soon as you get a design where CPU core chiplets are on either side of the bridge chip, then any movement will reduce performance.
We will likely see changes to optimize the layout of the heatpipes, or establish better thermal conductivity between them to ensure that multiple hotspots can be better handled.
Right now they are focused on just a single hotspot in the center.