I think im haveing issues cooling the R9 290
pic idle
steady 43c at idle seems high for aio(All In One)?
pic with graph just after load
85c under load. (gameing not benchmarking)
Edit: sorry, the thermaltake controller is for the cpu, the antec controller is for the gpu(The r9 290)
Several reviewers reported max around 45c G10 legitreviews
I have installed
VRM stickon heatsinks
vrm's on card
I found out the hard way the chips with metal tops cannot be directly heatsinked :/
tried booting up with them all installed and the psu would go into failsafe.
after an hour i figured it out. and installed gelid vrm heatsinks with thermal pads
So under load the back of the card feels hot, but way cooler then reference.
so i think the mini heatsinks are knocking it out of the park.
But the gpu is still as you can tell in the graphs getting very hot.
the only logical explanation is the asetek block isnt contacting the die very well.... but every time
i take the block off, the thermal paste shows it was making full contact..
I have the stuff to polish the asetek block(it currently has factory machining marks) but i'd like to wait tell the system is some what close to other peoples temps before polishing it.
That way i know its not a uneven polish job or something screwing up temps.
FYI: I have a corsair h55 and a thermaltake water 3.0 extreme on standby(havent tried them cause i assume i'll get the same results)
pic idle
steady 43c at idle seems high for aio(All In One)?
pic with graph just after load
85c under load. (gameing not benchmarking)
Edit: sorry, the thermaltake controller is for the cpu, the antec controller is for the gpu(The r9 290)
Several reviewers reported max around 45c G10 legitreviews
I have installed
VRM stickon heatsinks
vrm's on card
I found out the hard way the chips with metal tops cannot be directly heatsinked :/
tried booting up with them all installed and the psu would go into failsafe.
after an hour i figured it out. and installed gelid vrm heatsinks with thermal pads
So under load the back of the card feels hot, but way cooler then reference.
so i think the mini heatsinks are knocking it out of the park.
But the gpu is still as you can tell in the graphs getting very hot.
the only logical explanation is the asetek block isnt contacting the die very well.... but every time
i take the block off, the thermal paste shows it was making full contact..
I have the stuff to polish the asetek block(it currently has factory machining marks) but i'd like to wait tell the system is some what close to other peoples temps before polishing it.
That way i know its not a uneven polish job or something screwing up temps.
FYI: I have a corsair h55 and a thermaltake water 3.0 extreme on standby(havent tried them cause i assume i'll get the same results)
This Computer
PerformanceTest Information:
PerformanceTest Version: 8.0 (1037) WIN64
PassMark Rating: (N/A)
System Information:
System Name: DESKTOP-PQTBTD1
Model:
Operating System: Windows 8.1 Professional Edition build 9600 (64-bit)
Motherboard Manufacturer: ASRock
Motherboard Model: 990FX Extreme9
Motherboard Version:
BIOS Manufacturer: American Megatrends Inc.
BIOS Version: BIOS Date: 06/04/14 11:07:19 Ver: 04.06.05
BIOS Release Date: 2014/06/04
CPU Information:
Manufacturer: AuthenticAMD
Type: AMD FX-8150 Eight-Core
Codename: Bulldozer
CPUID: Family 15, Model 1, Stepping 2, Revision OR-B2
Socket: AM3+
Lithography: 32nm
Number of CPU's: 1
Cores per CPU: 4
Logicals per Core: 2
Clock Frequencies:
Measured Speed: 3602.4 MHz
Multiplier: 18.0X
Bus Speed: 200.1 MHz
Front Side Bus Speed: (N/A)
Timing Error Ratio: 1.000
Cache per CPU package:
L1 Instruction Cache: 8 x 16 KB
L1 Data Cache: 8 x 64 KB
L2 Cache Size: 8 x 2 MB
L3 Cache: 8 MB
Memory Information:
Total Physical Memory: 16337MB
Available Physical Memory: 13354MB
Memory Devices:
Slot 1: 4GB DDR3 SDRAM PC3-14933
G Skill Intl F3-14900CL9-4GBSR
XMP: 1.50V, Clk: 933.3MHz, Timings 9-10-9-28
Slot 2: 4GB DDR3 SDRAM PC3-14933
G Skill Intl F3-14900CL9-4GBSR
XMP: 1.50V, Clk: 933.3MHz, Timings 9-10-9-28
Slot 3: 4GB DDR3 SDRAM PC3-14933
G Skill Intl F3-14900CL9-4GBSR
XMP: 1.50V, Clk: 933.3MHz, Timings 9-10-9-28
Slot 4: 4GB DDR3 SDRAM PC3-14933
G Skill Intl F3-14900CL9-4GBSR
XMP: 1.50V, Clk: 933.3MHz, Timings 9-10-9-28
Virtual Memory: C:\pagefile.sys (2432MB)
Drive Information:
Physical Drive 1: Hitachi HUA722020ALA331
Drive Size: 1863GB
Partitions: H:
Interface Type: SATA
Bytes per Sector: 512
RPM: 7200
Physical Drive 2: ST2000DM001-9YN164
Drive Size: 1863GB
Partitions: D: F:
Interface Type: SATA
Bytes per Sector: 512
RPM: 7200
Physical Drive 3: Samsung SSD 850 EVO 250GB
Drive Size: 232GB
Partitions: C:
Interface Type: SATA
Bytes per Sector: 512
RPM: Solid State
Physical Drive 4: Hitachi HDS722020ALA330
Drive Size: 1863GB
Partitions: G:
Interface Type: SATA
Bytes per Sector: 512
RPM: 7200
Optical Drive 1: ELBY CLONEDRIVE SCSI CdRom Device
Volume Information:
Volume 1: C: [Local Drive]
File System: NTFS
Drive Cluster Size: 4KB
Volume Size (Free space): 209.1GB (46.3GB)
Volume 2: D: [Local Drive]
File System: NTFS
Drive Cluster Size: 4KB
Volume Size (Free space): 0.1GB (0.1GB)
Volume 3: E: [Optical drive]
File System:
Drive Cluster Size:
Volume Size (Free space):
Volume 4: F: [Local Drive]
File System: NTFS
Drive Cluster Size: 4KB
Volume Size (Free space): 1862.9GB (1618.3GB)
Volume 5: G: [Local Drive]
File System: NTFS
Drive Cluster Size: 4KB
Volume Size (Free space): 1863.0GB (914.8GB)
Volume 6: H: [Local Drive]
File System: NTFS
Drive Cluster Size: 1KB
Volume Size (Free space): 1862.9GB (1862.5GB)
Video Adapters:
Description: AMD Radeon R9 290
Chip Type: AMD Radeon Graphics Processor (0x67B1)
DAC Type: Internal DAC(400MHz)
Memory: 4095MB
Video BIOS: 113-C6790100-X02
Driver Provider: Advanced Micro Devices, Inc.
Driver Version: 15.201.1151.1005
Driver Date: 10-12-2015
Monitor 1: 1680x1050x32 60Hz (Primary monitor)
Temperatures:
Description: CPU 0
Temperature: 26.00C
Description: HDD 1 (Hitachi HDS722020ALA330)
Temperature: 42.00C
Description: HDD 2 (Hitachi HUA722020ALA331)
Temperature: 38.00C
Description: HDD 3 (ST2000DM001-9YN164)
Temperature: 35.00C
Description: GPU 0 (AMD Radeon R9 200 Series)
Temperature: 54.00C
PerformanceTest Information:
PerformanceTest Version: 8.0 (1037) WIN64
PassMark Rating: (N/A)
System Information:
System Name: DESKTOP-PQTBTD1
Model:
Operating System: Windows 8.1 Professional Edition build 9600 (64-bit)
Motherboard Manufacturer: ASRock
Motherboard Model: 990FX Extreme9
Motherboard Version:
BIOS Manufacturer: American Megatrends Inc.
BIOS Version: BIOS Date: 06/04/14 11:07:19 Ver: 04.06.05
BIOS Release Date: 2014/06/04
CPU Information:
Manufacturer: AuthenticAMD
Type: AMD FX-8150 Eight-Core
Codename: Bulldozer
CPUID: Family 15, Model 1, Stepping 2, Revision OR-B2
Socket: AM3+
Lithography: 32nm
Number of CPU's: 1
Cores per CPU: 4
Logicals per Core: 2
Clock Frequencies:
Measured Speed: 3602.4 MHz
Multiplier: 18.0X
Bus Speed: 200.1 MHz
Front Side Bus Speed: (N/A)
Timing Error Ratio: 1.000
Cache per CPU package:
L1 Instruction Cache: 8 x 16 KB
L1 Data Cache: 8 x 64 KB
L2 Cache Size: 8 x 2 MB
L3 Cache: 8 MB
Memory Information:
Total Physical Memory: 16337MB
Available Physical Memory: 13354MB
Memory Devices:
Slot 1: 4GB DDR3 SDRAM PC3-14933
G Skill Intl F3-14900CL9-4GBSR
XMP: 1.50V, Clk: 933.3MHz, Timings 9-10-9-28
Slot 2: 4GB DDR3 SDRAM PC3-14933
G Skill Intl F3-14900CL9-4GBSR
XMP: 1.50V, Clk: 933.3MHz, Timings 9-10-9-28
Slot 3: 4GB DDR3 SDRAM PC3-14933
G Skill Intl F3-14900CL9-4GBSR
XMP: 1.50V, Clk: 933.3MHz, Timings 9-10-9-28
Slot 4: 4GB DDR3 SDRAM PC3-14933
G Skill Intl F3-14900CL9-4GBSR
XMP: 1.50V, Clk: 933.3MHz, Timings 9-10-9-28
Virtual Memory: C:\pagefile.sys (2432MB)
Drive Information:
Physical Drive 1: Hitachi HUA722020ALA331
Drive Size: 1863GB
Partitions: H:
Interface Type: SATA
Bytes per Sector: 512
RPM: 7200
Physical Drive 2: ST2000DM001-9YN164
Drive Size: 1863GB
Partitions: D: F:
Interface Type: SATA
Bytes per Sector: 512
RPM: 7200
Physical Drive 3: Samsung SSD 850 EVO 250GB
Drive Size: 232GB
Partitions: C:
Interface Type: SATA
Bytes per Sector: 512
RPM: Solid State
Physical Drive 4: Hitachi HDS722020ALA330
Drive Size: 1863GB
Partitions: G:
Interface Type: SATA
Bytes per Sector: 512
RPM: 7200
Optical Drive 1: ELBY CLONEDRIVE SCSI CdRom Device
Volume Information:
Volume 1: C: [Local Drive]
File System: NTFS
Drive Cluster Size: 4KB
Volume Size (Free space): 209.1GB (46.3GB)
Volume 2: D: [Local Drive]
File System: NTFS
Drive Cluster Size: 4KB
Volume Size (Free space): 0.1GB (0.1GB)
Volume 3: E: [Optical drive]
File System:
Drive Cluster Size:
Volume Size (Free space):
Volume 4: F: [Local Drive]
File System: NTFS
Drive Cluster Size: 4KB
Volume Size (Free space): 1862.9GB (1618.3GB)
Volume 5: G: [Local Drive]
File System: NTFS
Drive Cluster Size: 4KB
Volume Size (Free space): 1863.0GB (914.8GB)
Volume 6: H: [Local Drive]
File System: NTFS
Drive Cluster Size: 1KB
Volume Size (Free space): 1862.9GB (1862.5GB)
Video Adapters:
Description: AMD Radeon R9 290
Chip Type: AMD Radeon Graphics Processor (0x67B1)
DAC Type: Internal DAC(400MHz)
Memory: 4095MB
Video BIOS: 113-C6790100-X02
Driver Provider: Advanced Micro Devices, Inc.
Driver Version: 15.201.1151.1005
Driver Date: 10-12-2015
Monitor 1: 1680x1050x32 60Hz (Primary monitor)
Temperatures:
Description: CPU 0
Temperature: 26.00C
Description: HDD 1 (Hitachi HDS722020ALA330)
Temperature: 42.00C
Description: HDD 2 (Hitachi HUA722020ALA331)
Temperature: 38.00C
Description: HDD 3 (ST2000DM001-9YN164)
Temperature: 35.00C
Description: GPU 0 (AMD Radeon R9 200 Series)
Temperature: 54.00C