News Rumor: AMD's EPYC Milan-X CPU to Have 3D Die Stacking

thGe17

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Sep 2, 2019
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Most likely this is simply HBM2-memory on the CPU package substrate ... the same already known for Sapphire Rapids SP to be the case, which seems to have up to 64 GiB directly on the package, speeding up AI-workloads and working as a large L4.
In this case, X3D is according to 3D more something like marketing and does not directly compete with Intels Foveros.

Stacking compute tiles with Milan-X on the other hand is currently highly unlikely because of thermals.
 

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