here is the ram i bought
https://www.corsair.com/us/en/Categ.../Vengeance-PRO-RGB-Black/p/CMW32GX4M2Z3600C18
i take a look at my ASUS TUF B660M-PLUS motherboard QVL list and i found that the AMD 16GB kit RAM is listed, but the AMD 32GB kit RAM isn't
sorry bro but i didn't understand your commendit most likely means XMP might now work on intel, do you feel like beta tester?![]()
ah i made a typo, it was meant to be "not working on intel"sorry bro but i didn't understand your commend![]()
Hey there,can Ryzen AMD optimized RAM to be overclocked with Intel CPU and Motherboard ?
i have VENGEANCE® RGB PRO, with AMD logo but with no XMP intel Certified logo
does that mean i cant use XMP with it ?
here is the ram i boughtHey there,
Please link the ram modules you bought/or buying.
Most DIMMs will work on both systems. You set up XMP and away you go.
For some mobo manufacturers like Asus, they call it DOCP for AMD systems. But they can run on either Intel or AMD.
here is the ram i bought
https://www.corsair.com/us/en/Categ.../Vengeance-PRO-RGB-Black/p/CMW32GX4M2Z3600C18
i take a look at my ASUS TUF B660M-PLUS motherboard QVL list and i found that the AMD 16GB kit RAM is listed, but the AMD 32GB kit RAM isn't
can Ryzen AMD optimized RAM to be overclocked with Intel CPU and Motherboard ?
i have VENGEANCE® RGB PRO, with AMD logo but with no XMP intel Certified logo
does that mean i cant use XMP with it ?
QVL is worthless garbage. And what's worse is that ppl totally misunderstand its purpose.
The QVL is Qualified Vendor List. Not Qualified Ram List. It is not a guarantee or certification or even a statement that specific model ram will work, and ram not on the list is neither tested nor 100% compatible.
What the QVL really is is a list of ram in different kits, sizes, speeds all tested to say 'hey our board works, see we tested some ram and it was good'. The QVL qualifies the motherboard, not the ram used on it.
Makes exactly no difference whether a particular model was used or not, the ram has the same chances of working or compatibility as any other ram.
To get a true QRL, you'd have to hit up G.Skill or Crucial, who do actually test their ram extensively on every motherboard they can get their hands on, and keep records of whether the ram is compatible or not.
Ram model numbers contain its make up. That means heatsink design, color, rgb, as well as speed, Cas, kit, size etc. If you test 3200MHz Cas 14 rgb 2x8Gb Trident-Z, it's exactly the same Samsung B-die as the 3200MHz Cas 14 Camo 2x8Gb Trident-Z. The only difference being the color/rgb, but that change affects the model number. So if you find the RGB is tested on a QVL, and the Camo isn't, that doesn't mean anything other than that color was picked. It's the same ram, regardless if it was 2x8Gb, 1x8Gb or 4x8Gb.
If you see Corsair LPX on a QVL, that's SkHynix ram ic's. It means every single other model and brand using those same SkHynix ic's has also been verified, and SkHynix also manufactures ram for Dell. You'd have the same chance using Dell labeled ram as Corsair LPX.
The QVL just says the board was tested as good with a variety of speeds, sizes, ic's, kits and works. It doesn't disqualify ram because it's not on the list of tested ram.
That is fundamentally incorrect. The motherboard manufacturer cannot tell you if ANY ram will work, whether they tested or not.If the kit is not on the QVL it means the motherboard manufacture cannot tell you if it should work.
That is fundamentally incorrect. The motherboard manufacturer cannot tell you if ANY ram will work, whether they tested or not.
It's exactly the same as mixing kits. You don't. Because even though the heatsink is identical, speeds, sizes, model number, everything on the outside is identical, the silicon the IC's are made of isn't. The physical sticks used in testing might work on the mobo, but any identical model bought from a store has the exact same chances of working as a model not tested.
The QVL qualifies the board. It's only saying that the board was tested with several different OEMs at claimed speeds, kits, sizes, and worked with no issue. Has Zero to do with the actual model.
There's no warranty, period. Regardless of whether the ram works or not, on the QVL or not. If you try and RMA a motherboard and say the ram was on the QVL but didn't work, the vendor will still claim it to be a ram issue and not a motherboard issue unless you can prove multiple kits do not work and multiple cpus do not work.If you get a kit outside of the memory QVL there is no warrenty to work with the motherboard.
Motherboards do not know what IC bin is. And don't care. If xpm/DOCP is an option, it's available. It's listed with the jedec. If for whatever reason it will not go above jedec, it's a ram issue, not a QVL issue or motherboard issue.Say you get for example a kit with e-die and the motherboard doesn't know want that IC is and thus can't go above jedec. If its not in the QVL then its your problem,
There's no warranty, period. Regardless of whether the ram works or not, on the QVL or not. If you try and RMA a motherboard and say the ram was on the QVL but didn't work, the vendor will still claim it to be a ram issue and not a motherboard issue unless you can prove multiple kits do not work and multiple cpus do not work.
Motherboards do not know what IC bin is. And don't care. If xpm/DOCP is an option, it's available. It's listed with the jedec. If for whatever reason it will not go above jedec, it's a ram issue, not a QVL issue or motherboard issue.
The QVL has absolutely nothing to do with the ram other than qualify the motherboard to run those speeds.
F4-3200C14D-32GTZKW
F4-3200C14D-32GTZSW
Those are identical in every way. Same binned Samsung B-die IC' s, 14-14-14-34, same vendor, same size, same 2x16Gb. The ONLY difference is the GTZSW is Silver heatsink with White stripe and the GTZKW is Black heatsink with a White stripe. According to your logic, if the GTZKW was on the QVL and the GTZSW wasn't, then any issue would be 'your problem' since obviously the mobo doest like Silver heatsink ram, even though it cannot tell the difference since everything else is identical.
No. You are incorrect. The only thing about the ram on the QVL is that the mobo vendor tested 3200MHz 2x16Gb Samsung IC's, and the mobo worked. It does not matter if it was the GTZSW or GTZKW, they happened to only test one kit.
Theres over 3000 different model numbers just in the G.Skill Trident-Z DDR4 lineup. Add those to the RipJaws, Aries, value lines, then multiply all those by all the Kingston, Adata, Crucial, Patriot, Corsair and hundred other vendors and you'd have a QVL that was thousands of pages long, using millions of sticks of ram, costing a small fortune, that'd take thousands of manhours to test and compile and would have to be done for every single motherboard in the vendors lineup.
Which they do not do because it's absolutely pointless, they aren't trying to qualify the ram, they just use enough ram to say that the motherboard works at a rated speed.
DDR4, the fourth generation of DDR SDRAM technology, is the latest and greatest SDRAM standard and will continue to be until the fifth generation is released. The new standard features a point-to-point architecture that offers superior timing margins. In theory, this should make signal integrity easier to achieve since the designer has more leeway in routing and length matching of the different bit, clock and address lines, assuming operation at the same data rates. But most real-world designs are going to take advantage of DDR4’s ability to double the maximum rate and in this case routability will actually be considerably more challenging than with DDR3.
Overcoming Crosstalk
The higher data rates of DDR4 increase the edge rate which in turn increases the propensity for crosstalk. A general rule of thumb is to space out adjacent signal traces at least three times the trace width in order to minimize coupling effects. But it’s often difficult to implement such large trace spacing, especially on smaller PCBs such as those used in smartphones. This conundrum is increased by the fact that SDRAM uses a source synchronous clocking scheme in which all the signals in each signaling group propagate in one direction at the same time. In cases where large trace spacing cannot be achieved, the next best choice is typically to route these traces on stripline – inner PCB layers – instead of microstrip – the outer layer. This is because one side of microstrip does not have a power plane, resulting in greater dispersion of electromagnetic waves which in turn leads to a greater propensity for crosstalk to occur.
Avoiding Vias When Practical
But nothing is simple in PCB design and routing on inner layers can also create complications when DDR4 signals travel through vias from one layer of a PCB to another. Capacitance and losses in the vias can produce signal integrity problems, especially in the short stubs formed by the extension of the vias plating through to the other side of the PCB. One approach to address this problem is to minimize layer changes by routing mainly in the outer layers to avoid layer changes. But since, as mentioned earlier, routing on the outer layer increases the tendency towards crosstalk, other measures may be necessary. For example, backdrilling with numerically controlled drills to reduce the via stub length can significantly lower the bit error rate of the interconnect.
Tune the Silicon to the Board
Cases where designers have control over the silicon provide an additional avenue to address potential DDR4 problems. Devices such as field programmable gate arrays (FPGAs) enable engineers to move pins around to reduce trace lengths. While ICs, packages and PCBs are typically designed with point tools whose interface requires time-consuming manual processes, a new integrated 3D chip/package board co-design environment enables engineers to see the IC, package and PCB simultaneously in one view to optimize tradeoffs between the pin placement and PCB routing, among other things. This new approach makes it much easier to, for example, swap pins between banks, to achieve better length control.
Every kit is guaranteed by the factory to run at its rated XMP/DOCP speeds if the motherboard/cpu supports that speed and kit.So not every kit will work at the rated speed.
All boards with the same chipset have the same ability to support any given speed. The more expensive boards generally run T-topography and are better at overclocking any given speed past its XMP settings at a reasonable voltage and timings. Cheaper boards use Daisy chain, so aren't as good at OC, but will still be able to run ram at its rated XMP speeds.This is why the more expensive boards support better RAM speeds.
The bios is the exact same for any given vendor, it's written by Award or Phoenix etc for the vendor per chipset. The Difference in bios per board is the user choices and model specific components, but the core bios is the same.The BIOS is better tuned to train a vast array of different ICs and timings.
The only reason the QVL doesn't go higher is because vendors do not update the QVL, at the time that board was released, 3600 was the fastest commercially available ram, and even then might have been a prototype. Very rarely do they ever update any info whatsoever, any updates are relegated to bios updates and chipset driver updates. They do not retest the boards with newer and higher speed ram. At a certain point in time, they stop All updates as it's cost prohibitive to revisit older architectureI manually tuned DDR4-4000 with 4xDIMM on a motherboard who's QVL doesn't list my kit and has no 4xDIMM kits above DDR4-3600
Every kit is guaranteed by the factory to run at its rated XMP/DOCP speeds if the motherboard/cpu supports that speed and kit.
All boards with the same chipset have the same ability to support any given speed. The more expensive boards generally run T-topography and are better at overclocking any given speed past its XMP settings at a reasonable voltage and timings. Cheaper boards use Daisy chain, so aren't as good at OC, but will still be able to run ram at its rated XMP speeds.
The bios is the exact same for any given vendor, it's written by Award or Phoenix etc for the vendor per chipset. The Difference in bios per board is the user choices and model specific components, but the core bios is the same.
The only reason the QVL doesn't go higher is because vendors do not update the QVL, at the time that board was released, 3600 was the fastest commercially available ram, and even then might have been a prototype. Very rarely do they ever update any info whatsoever, any updates are relegated to bios updates and chipset driver updates. They do not retest the boards with newer and higher speed ram. At a certain point in time, they stop All updates as it's cost prohibitive to revisit older architecture
Before that my system wouldn't boot reliably at anything above 2666Mhz and I haven't seen anything above 2933. With a new BIOS however I can boot with up to 3333Mhz, It's not very stable though so Currently I'm maximazing timings at 3000Mhz. My RAM is 2x8GB 3000MHz CL15 Corsair vengeance LPX, hynix die. source
Which has exactly Nothing to do with the Ram. Ram is guaranteed to run at its XMP/DOCP rated settings. If the cpu imc can't support that, that's on the cpu, Not the ram.Not every CPU IMC will run a kit at xmp if the frequency or timings are too high
RAM manufactures also have QVL's for motherboards. XMP website lists supported CPU's for the profile and the kit. Thus the target IMC that is likely to work.Which has exactly Nothing to do with the Ram. Ram is guaranteed to run at its XMP/DOCP rated settings. If the cpu imc can't support that, that's on the cpu, Not the ram.