News Samsung 3D Stacks 12-Layer HBM2E Chips, Now 24GB of Capacity

[Admin]

Samsung 's new 12-Layer 3D-TSV chip packaging technology will allow the vendor to produce 24GB of the next generation of HBM2, HBM2E.

Samsung 3D Stacks 12-Layer HBM2E Chips, Now 24GB of Capacity : Read more

 

[PistolPaul]

Looks impressive and pricey! But mostly pricey!