News Semiconductor Researchers Solve Diamond Wafer Slicing Challenges With Lasers

Eximo

Titan
Ambassador
Freakin' laser beams.

Basically they are saying that adding a lot of energy turns it from diamond to some other carbon allotrope and then they just break it, or it breaks, upon the lines made by the laser.

Not sure why this wasn't a thing before?

Deliberately reaching out to news outlets is not a great sign...
 
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InvalidError

Titan
Moderator
Not sure why this wasn't a thing before?
Sub-surface laser focusing is how multi-layer BD discs work and also how designs get etched in acrylic cubes. Not really a new process, just a new higher-energy, higher-precision application for it.

Great, they solved the diamond-slicing problem. Still got to work on growing cheaper diamond wafers. Not sure the consumer electronics and automotive space is sufficiently concerned about efficiency to spend $60 000 per 3" diamond wafer just to gain another 1-2% on efficiency.
 
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