Been looking at the thermal paste reviews at http://www.tomshardware.co.uk/thermal-paste-performance-benchmark,review-32804.html and quite frankly its making my head spin. I have used pate a handful of times but am no expert. The reviews talk about high and lower mounting pressure but cant work out which is relevant for me. I am choosing a paste to mount a i7-4700MQ in a Dell Latitude e6440 (and yes, I realize the TDP is a little too high which is why I want get get a good paste). So is this high or lower mounting pressure.
Gelid Solutions GC-Extreme seems good but the review is a little confusing. It scores well with both low and high mounting pressure but then in the write up says
"GC-Extreme is the best thermal paste in our round-up, maintaining a slim lead over the runner-up as long as you're using a heat sink with high mounting pressure. If this compound was a little softer, it'd be even more ideal and wouldn't require warming before application. Heating it up a bit does pay off though, and we recommend it for overclockers and enthusiasts. Due to its high viscosity, it's perhaps less ideal for beginners."
As I said it actually seems to score very well for low and high mounting pressure, very confusing.
Last question, how do you heat up thermal paste?
Gelid Solutions GC-Extreme seems good but the review is a little confusing. It scores well with both low and high mounting pressure but then in the write up says
"GC-Extreme is the best thermal paste in our round-up, maintaining a slim lead over the runner-up as long as you're using a heat sink with high mounting pressure. If this compound was a little softer, it'd be even more ideal and wouldn't require warming before application. Heating it up a bit does pay off though, and we recommend it for overclockers and enthusiasts. Due to its high viscosity, it's perhaps less ideal for beginners."
As I said it actually seems to score very well for low and high mounting pressure, very confusing.
Last question, how do you heat up thermal paste?