Archived from groups: microsoft.public.windowsxp.hardware (
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The science is not being properly explained here. Thermal
resistance increases with each change of media. You want the
lowest thermal resistance; the highest thermal conductivity.
That means less media changes. The best thermal conductivity
is CPU directly to heatsink - no intermediate media such as
air, thermal paste, thermal tape, etc. For any properly
machined heatsink, no thermal paste or thermal tape is
necessary. However many heatsinks are not even machined.
Cheaper and more profitable to sell an inferior heatsinks
using thermal tape to correct the inferior surface.
Thermal paste, properly applied, fills microscopic holes
between the defective CPU and heatsink. A better heatsink has
minimal surface area covered with microscopic holes.
Therefore a more direct 'CPU to heatsink' interface exists.
IOW apply minimal thermal paste so that more heatsink
contacting CPU is THE best interface.
Thermal paste also compensates for humans who buy heatsinks
without first demanding numbers. The most important number -
and I don't read a single poster citing it - is 'degree C per
watt'. A lower number means less thermal resistance.
Properly machined heatsinks will have lower numbers.
BTW, many mistakenly assume properly machined means
perfectly flat. A perfectly flat heatsink does not apply
pressure where most required. Most all heat is transferred
via center of the heatsink. This is also why any thermal
paste in the outer one half of 'heatsink and CPU' interface is
1) wasted, and 2) indicates that too much thermal paste was
applied - causing less 'heatsink to CPU' contact. Apply so
little thermal paste so that none appears in outer half of
heatsink. Too much thermal paste only increases thermal
resistance.
Bottom line - first question one must ask: what is the
'degree C per watt spec' on that heatsink. No spec? Then
expect they are simply hiding behind an inferior but highly
profitable product.
There is essentially no difference between various thermal
pastes. Spend on the order of ten times more money for the
overhyped Arctic Silver. In fact, when one recommends Arctic
Silver, then they often don't even known basic technology such
as the all so critical 'degree C per watt' number.
A best thermal interface is direct 'CPU to heatsink'
connection. Anything that further fills in microscopic holes
(ie thermal paste) causes a single digit temperature
improvement - trivial. In fact if thermal paste results in
more than ten degree temperature improvement, then time to get
a better heatsink. Thermal paste and resulting CPU
temperature is a good benchmark test to identify inferior
heatsinks.
In the meantime, if thermal tape is required, then time to
first learn basic facts - such as the integrity of that
retailer who hyped that heatsink assembly. Thermal tape
solves symptoms - an inferior heatsink problem. Proper tape
usage is for devices that have marginal heat problems and need
the cheapest solution. This is not your CPU. Up front,
thermal tape is not a desirable solution to thermal
conductivity.
Bradley Dick wrote:
> So, can thermal tape be purchased seperately?
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