@rustedmetal
This : "1 W/ mk. "
You are not dealing with thermal paste where "1 W/ mk " directly applies.
My sense is that there are two different issues here:
1) Sealing/attaching the pipes.
2) Improving conductivity.
Seals/solder/glue/epoxy. etc. are to prevent leaks at joints.
The pipes are for the fluid carrying away heat.
Overall, as I understand the matter, the seals/solder/substrate do not need to be conductive.
They need to prevent leakage so the fluid can carry away the heat.
However if the substrate (as I understand
@CountMike 's post) helps with conductivity as well and sealing against leaks - then that would be a bonus.
Per
@hotaru.hino
"Then explain the entire system so we know what we're working with. "
Again - I suggest including some photographs.