News TSMC details 12.8 Tbps on-package communication solution — an efficient silicon photonics interconnect for AI

I am wondering if the integration of this silicon photonics technology could help create an Apple Pro Display XDR, that would have the same kind of connector used to connect to the Apple Pro stand (the magnetic circle) but that would also integrate silicon photonics connectivity : this would allow relocating the I/O to the bottom of the stand, and have integrated optical fibers inside the stand to transfer data from I/O (Thunderbolt 4, HDMI,…) to the display…
 
Aimed at data center, might trickle down to mainstream products in 10 years?
More likely, 20+ years as the industry has been talking about SiPho for at least 20 years with Intel showing some early progress 10+ years ago.

Will be interesting to see this technology realized.
 
More likely, 20+ years as the industry has been talking about SiPho for at least 20 years with Intel showing some early progress 10+ years ago.

Will be interesting to see this technology realized.

In this case, the adaption would be quicker as TSMC is releasing the tech for its customers. Its not locked to Intel. So chip designers would readily adapt them if the price and performance proves beneficial.
 
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In this case, the adaption would be quicker as TSMC is releasing the tech for its customers. Its not locked to Intel. So chip designers would readily adapt them if the price and cost proves beneficial.
Right now, I can't even see a use case for this in consumer machines. That doesn't mean it won't happen within 10 years, but I just can't see far enough ahead to have an idea of what sorts of problems would justify it.