News TSMC to build base dies for HBM4 memory on its 12nm and 5nm nodes

[Admin]

TSMC to use 12FFC+ and N5 process technologies to build base dies for HBM4.

TSMC to build base dies for HBM4 memory on its 12nm and 5nm nodes : Read more

 

[usertests]

Making a commodity like memory on 5nm just shows how big the AI bubble is.

 

[bit_user]

Making a commodity like memory on 5nm just shows how big the AI bubble is.

It's just the logic-containing base die, not the entire stack! As mentioned in the article, there are 12 or 16 DRAM dies stacked atop it, providing 48 GB or 64 GB of memory capacity.

 

[kjfatl]

There is a reason that few companies are successful in making both memory and logic ICs. In makes no sense for memory companies to make the base dies when they can be purchased as commodities from TSMC today and perhaps Intel tomorrow. The only company that is successful in making both logic and memory is Samsung. They are the only company in the industry who is truly vertically integrated. (Appliances, displays, TV's Phones and most of the parts used to make them).