News TSMC to go 3D with wafer-sized processors — CoW-SoW system-on-wafer technology allows 3D stacking for the world's largest chips

[Admin]

TSMC plans to integrate HBM4 with system-on-wafer designs in 2027.

TSMC to go 3D with wafer-sized processors — CoW-SoW system-on-wafer technology allows 3D stacking for the world's largest chips : Read more

 

[edzieba]

A 'chip' sucking down 18,000 amps and shunting out 15kW. That'll need what, maybe 2 or 3 Noctua coolers?

 

[HaninTH]

Immersion cooling will be necessary for these massive things? Possibly with an exotic coolant.

 

[Notton]

How would you design a heatsink so it applies even pressure over that die size?
How do you keep the die or joints from cracking when it goes through a heating/expansion and cooling/contraction cycle?

 

[Steve Nord_]

Just regular microjet coolers would be lovely, but you guys are showing like legal size Culver's ads in a letter sized ad space, and it's trashing your columns. I'm not even getting swole from all the dairy, c'mon.

 

[Mpablo87]

I heard some Austrian Startup offers ideas for cooling ! ! ! ! !
Maybe that size is acceptable ? ! ? ! ?