thestryker
Judicious
I still don't understand what you're on about here because the benefits of on package memory are lower power and latency not performance. Adding SMT back doesn't help with either of those things and Intel already made the decision that the benefits of removal were greater than having it.The other way around, I think that the next gen not having the memory might lead them into putting htt back.
It would be too easy of an option for them to not think about it.
Yes... exactly... unless you think 8p/16e is the configuration of the future and it will be able to keep up with whatever AMD is doing.They would only need to design larger dies if they need to fit more cores into future CPUs.
It seems like you're either mixing a bunch of things up or just don't quite understand what I was saying.If the next gen is going to use multiple dies it is going to be to shrink the dies and not to make them bigger/keep them as big as they are, there is near to zero reason for intel to go up to 50+ cores on a desktop CPU let alone a mobile CPU, since you are so keen on thinking that desktop is only a byproduct of mobile, but keeping the same number of cores as they have now and simultaneously have smaller dies=higher yield from their 18A especially in the beginning makes all the sense in the world.
What I'm saying is that Intel will likely make some sort of compute tile (all rumors are pointing towards NVL being 8p/16e) that makes the most sense for the majority of their client desktop parts and high performance mobile volume. If they double up the compute tile for say the top two desktop SKUs this likely beats whatever AMD has in that segment. Going up to 16p/32e doesn't matter if it's more beneficial to the company than making a separate 12p/24e compute tile is.