First see the image at bottom. This gives all details. Which gives better heat management? Using the light blue adhesive thermal pad? Or not using it? (just place the copper heat sink right on top of the NVME?)
If it’s better not to use the thermal pad, should I use some thermal conductive paste? Or not really needed?
If it’s better not to use the thermal pad, then I would just use 1 or 2 rubber bands to secure the copper heat sink to the NVME.
I’m using the NVME as an external drive to make a full backup (clone) of my internal main drive. When I use the external NVME for the clone, it takes about 25 min. If I use an external hard drive it takes about 43 hours.
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If it’s better not to use the thermal pad, should I use some thermal conductive paste? Or not really needed?
If it’s better not to use the thermal pad, then I would just use 1 or 2 rubber bands to secure the copper heat sink to the NVME.
I’m using the NVME as an external drive to make a full backup (clone) of my internal main drive. When I use the external NVME for the clone, it takes about 25 min. If I use an external hard drive it takes about 43 hours.
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