13thmonkey :
Because server cases are nearly flat (mostly), consumer cases are a lot deeper so air flows up and over the ram, the sticks at the top of the server board would be in the air shadows of (what was) the ODD bays. There's also more scope for bigger air coolers on the consumer board which allows for quieter cooling, servers don't care too much about noise.
Yea, but what about HTPC and other shallow case? Also, we all see ODD is getting rare nowadays even most cases no longer have ODD bay. I don't see any disadvantages applying server layout to consumer M/B and some ITX board (mostly FM) has vertical RAM layout. I'd like to see more.
atljsf :
most server mainboards are flat and designed to have over or near them lots of fans, 8 on ost models
that is great for airflow, but sounds like a jet engine all the time, i don't want such noise on my house all the time only to play some games or watch netflix
Wait, isn't more obstacle causes more noise? I see horizontal RAM and 24 pin placement create more obstacle to horizontal airflow in most PC cases.
atljsf :
a server is meant to be set and left alone for 5 years more or less
the desktop pc in 5 years, usually gets enough upgrades to not be concerned for tis
on a desktop pc, you can buy low profile ram, a air cooler with better airflow thinking on that and the mainbaord, that one you posted there, the plastic parts can be removed if you consider they are a air flow problem
the area near the cpu uses heatsinks on most models, big ones, and your air cooler should blow cold air over them to keep them working properly
Plastic I/O ports cover? Nah, I was talking about the RAM and 24 pin placement which is directly blocking air from reaching CPU, especially in shallow HTPC / itx cases. I know the difference won't be much, probably not more than 2-3 degree celcius but I don't see any disadvantages having this layout on consumer MB, so why not?
atljsf :
one thing that is clear form those two pictures is the amount of vrms and chokes on the mainboard of the left, thnking that you are going to overclock it, the server will not let you overclock, speeds will be kept at stock settings, so lesss vrms and chokes, so ram modules can be set up there
*cough* non overclocked itx / matx setup *cough*
atljsf :
that mainboard is part server and part workstation, and it has lots of ram slots, when populated, they also blco airflow so you must use low profile ram modules and sometimes add another fan on that area, each workstation decides what to put or where to put it and how loud it will be
also remember that the consumer mainboard is small, the server one is almost the double of that, so you have space to play with in terms of ram location and component locations, the home pc, doesn't have all that space and full atx mainboards are not popular anymore, micro atx and atx mainboards is what is sold now, no full atx is sold anymore
the size of a pc case for a full atx mainboard is enormous, we are on the time where a mini itx is seen as big, well, that mainboard for the workstation is monstrous in comparison
You lost me at "consumer mainboard is small, the server one is almost the double of that, so you have space to play with in terms of ram location and component locations" Are you saying that server M/B able to have that layout because it has less components and bigger size?
Well, we also have small server board with same horizontal RAM and 24 pin connector. So I think board size is not the problem. Like this itx server board vs itx consumer board. Even between these two itx, the server M/B has more components and connector on it (more SATA connectors and VRM for example).
So, my points are:
1. Horizontal RAM layout on server board helps with airflow because most PC cases today have air moving horizontally from front to back, allowing air to move in between RAM modules easily.
2. We're no longer using ODD now, and it allows us to install fan on what used to be ODD bay, to move air on top of the M/B to cool down RAM modules.
3. Horizontal 24 pin placement also help with either airflow and cable management. you can just pull the cable vertically to the top of the case, no need to bend it 90 degrees to to reach the right side of the M/B where 24 pin connector is located. Also 24 pin is thick and dense, blocking air to reach CPU and VRM area.
4. Most cases have horizontal airflow, from front to back. Why don't place the components horizontally so air can easily move in between them?
See, there are no disadvantages of having server layout. except maybe, less space for big tower heatsink. But on small itx / matx build, I see more advantages and almost no disadvantages so why not?