delusion77
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- Aug 13, 2008
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I want them to create a Corsair H70 knock off and sell it for $60. Large Air coolers that take up 40% of the case are lame, water cooling ftw!
Create an easy to manufacture micro Sterling engine, which would be mounted on the chip. Sterling engines derive power from the difference between two temps and can be used as an air conditioning system. So, as the chip gets hotter, relative to the cooler surrounding air, the Sterling engine would become more powerful and be more efficient at cooling, which would negate the excess heat.
A complete cooling solution.
A round tower built of aluminum with fins on the inside.
The walls of the casing would be hollow inside for the liquid. On the bottom of the tube there would be a large
slow fan the size of the tower, 250mm+. This fan would make no noise in normal operation, but help air travel up the case
to the top, and a fan controller should turn if off when not needed.
The power supply would be long and flat, and the motherboard mounted inside the round tower with hdd etc. On top of the tube there could be a vent for hot air, below
an area for drive bays, LEDS and jack for the user (headphones,mic,USB etc) .
The tower could have several configurations and sizes.
Inside the tower there would be connections for water cooling + connection for attaching heat pipes to the water cooled tower.
1. Simple solution - low power
All components with heatsinks
2. Simple solution - some more power
Most components with heatsinks, while CPU and GPU attached to heat pipes.
3. Normal solution - power
Water cooling for CPU and GPU, heatsinks for other components
4. Power solution - power
Water cooling for CPU and GPU, heat pipes for other components
5. Extreme solution
All components water cooled.
The outside of the tower would be could be round with 1 square edge, or just square at the top for DVD/Blueray players.
A pump would transport water up through the components and dump it at the top of the tower wall.
|------|
| |
A round tower built of aluminum with fins on the inside.
The walls of the casing would be hollow inside for the liquid. On the bottom of the tube there would be a large
slow fan the size of the tower, 250mm+. This fan would make no noise in normal operation, but help air travel up the case
to the top, and a fan controller should turn if off when not needed.
The power supply would be long and flat, and the motherboard mounted inside the round tower with hdd etc. On top of the tube there could be a vent for hot air, below
an area for drive bays, LEDS and jack for the user (headphones,mic,USB etc) .
The tower could have several configurations and sizes.
Inside the tower there would be connections for water cooling + connection for attaching heat pipes to the water cooled tower.
1. Simple solution - low power
All components with heatsinks
2. Simple solution - some more power
Most components with heatsinks, while CPU and GPU attached to heat pipes.
3. Normal solution - power
Water cooling for CPU and GPU, heatsinks for other components
4. Power solution - power
Water cooling for CPU and GPU, heat pipes for other components
5. Extreme solution
All components water cooled.
The outside of the tower would be could be round with 1 square edge, or just square at the top for DVD/Blueray players.
A pump would transport water up through the components and dump it at the top of the tower wall.
|------|
| |
tsnorquist
Distinguished
- Dec 8, 2009
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- 18,780
Zalman
My idea would be to develop a hybrid Heat Sync & Fan with a low boiling point liquid reservoir system. Pentane for example would be an ideal choice of liquid due to its low boiling point (around 97 degree Fahrenheit).
A vertical cylinder comprised of hollow heat pipes and heat fins molded to the pipes(as in your picture above) is placed directly over the CPU.
Attached to the top of the vertical cylinder would be a 80mm silent fan to assist in cooling.
Within the heat pipes is the Pentane solution which when heated, begins to boil. This boiling would then traverse through the vertical heat pipes out to a reservoir of Pentane which would then be recycled back through the heat pipe/fin arrangement. Cooler Pentane would then be brought in as the cycle repeats itself.
The purging of any air from the system would create a closed loop, thus eliminating the need for a mechanical pump.
PS: Not an engineer, but the idea sounds good in my mind.
My idea would be to develop a hybrid Heat Sync & Fan with a low boiling point liquid reservoir system. Pentane for example would be an ideal choice of liquid due to its low boiling point (around 97 degree Fahrenheit).
A vertical cylinder comprised of hollow heat pipes and heat fins molded to the pipes(as in your picture above) is placed directly over the CPU.
Attached to the top of the vertical cylinder would be a 80mm silent fan to assist in cooling.
Within the heat pipes is the Pentane solution which when heated, begins to boil. This boiling would then traverse through the vertical heat pipes out to a reservoir of Pentane which would then be recycled back through the heat pipe/fin arrangement. Cooler Pentane would then be brought in as the cycle repeats itself.
The purging of any air from the system would create a closed loop, thus eliminating the need for a mechanical pump.
PS: Not an engineer, but the idea sounds good in my mind.
wolfram23
Splendid
- Apr 12, 2010
- 6,313
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- 26,460
I'd like to see a heat sink with actual sides to it, so it's like a wind tube. 4 copper pipe rings (somewhat like the pic in this article) would form the basis, direct touch of course. They'd go vertical along one axis, but they'd all be angled away from eachother (Like a V inside another V) off the block for about 1.25" height, then flare outward to form the parallel rings. Either copper or maybe something like a metal foam or graphic tubes as heat spreaders (bringing new technology to the field is great), with a low profile fan on either end to minimize room, like those Scythe 120x12mm slim fans and a normal 120mmx25mm fan in the middle. A cylinder will wrap it up to force the air over the fins so there's better pressure and air flow. It could also have a slight offset so that it covers the NB moreso than the RAM. It would ideally run with low CFM since there's less losses of pressure and having 3 fans, therefore it would be quiet and fit in with the CNPS series.
And of course, lots of blue LEDs... in fact, the cylinder cover could be clear and have LEDs running through the center.
And of course, lots of blue LEDs... in fact, the cylinder cover could be clear and have LEDs running through the center.
maestintaolius
Distinguished
- Jul 16, 2009
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- 18,980
[citation][nom]deeelwy[/nom]Most great heat sinks are make out of copper, because it conducts heat better than aluminum and similar materials. But ever since I heard that silver is the best heat conductor, I always wondered why nobody had ever made a heat sink out of it. I know it's a precious metal, and much more expensive than even copper, but if you're going to make the best heat sink, you should use the best materials.[/citation]
Because it's a very minor improvement (~5%) at a very major cost (90x more) whereas aluminum to copper is a 60% improvement at 3x the cost.
Because it's a very minor improvement (~5%) at a very major cost (90x more) whereas aluminum to copper is a 60% improvement at 3x the cost.
Huge rectangular block of relatively thick fins, with sufficient spacing. As wide, as deep, and as high that can fit in on a regular ATX board in a midsize tower (something like an Antec 300). All copper. Direct heatpipes. As many heatpipes as you can fit. Push pull fan setup with 120mm fans. As short as possible heatpipes, to allow as many fins as possible. It doesn't matter if the fans don't cover all of the fins.
lukeskywalker
Distinguished
- Jan 30, 2010
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How about model the problem, components and properties of materials and use genetic algorithms to evolve the cheapest and most efficient design.
http://www.youtube.com/watch?v=eDxze0lUErQ
http://www.youtube.com/watch?v=eDxze0lUErQ
IzzyCraft
Distinguished
- Nov 20, 2008
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[citation][nom]DiamondT[/nom]How about a squirrel cage fan instead of the normal fan?Like the ones in your furnace? Very powerful and not as loud as a conventional fan for the same air moving.[/citation]
You could probably try something like that on their CNPS7000 like modle with some modifications but i don't see how that would work with most vertically oriented kind of cpu coolers now of days
You could probably try something like that on their CNPS7000 like modle with some modifications but i don't see how that would work with most vertically oriented kind of cpu coolers now of days
Idea 1 - Implement the cooling into the case by applying thin sheets of metal in a cool design around the case and have them drawing heat from the heat sink.
Idea 1 mod - (Similar to the fir tree idea, what in nature has great surface area?)
Like our small intestinal villi, have heat conductive villous ridges in a conductive tubing system or connected to the case mentioned above.
Idea 2 - since heat rises, maybe we can decrease turbulence by blowing air strait out the top
Idea 1 mod - (Similar to the fir tree idea, what in nature has great surface area?)
Like our small intestinal villi, have heat conductive villous ridges in a conductive tubing system or connected to the case mentioned above.
Idea 2 - since heat rises, maybe we can decrease turbulence by blowing air strait out the top
shortbus25
Distinguished
- May 17, 2009
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- 18,630
Give us somewhere to submit drawings I can do that but explaining my design is tough! I have hundreds of Ideas!
lukeskywalker
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- Jan 30, 2010
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Trialsking
Distinguished
- Mar 2, 2007
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[citation][nom]jerreece[/nom]Hehe sounds like Zalman lost or laid off their engineer maybe?[/citation]
Thats what I was thinking! Get some uber geek/techno wizkid to come up with an awesome design to make millions with and give then the kid a free HSF in return! What did P.T. Barnum say..........
Thats what I was thinking! Get some uber geek/techno wizkid to come up with an awesome design to make millions with and give then the kid a free HSF in return! What did P.T. Barnum say..........
shortbus25
Distinguished
- May 17, 2009
- 65
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- 18,630
How about just figure out a way to make my CPU stay at 20C and not run the risk of condensation on the mobo. Figure that out make it look like what ever you want i'll buy it!!
babachoo
Distinguished
- Nov 17, 2009
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- 18,790
This is hard to explain and I'm a terrible artist so I won't even try to draw it out. I present to you, my idea for a new cooler I would call the Triforce.
1. 5 pipes directly touching which then rise off of the chip on both sides of the chip by around 1/2". Then these pipes will NOT rise vertically where they are typically capped. They will instead snake around in a sort of horizontal but gradually upward spiralling form, eventually being capped towards the top of the cooler, with the pipes facing horizontally and parallel to the chip at this point.
2. Fins will run perpindicular and vertical to the chip, rather than horizontal, approximately being 1/2" wide on each side.
3. The entire cooler will have a triangular shape. If you looked at it from the top down you would see an equilateral triangle with three sides of vertical fins encasing pipes, and each side would be around 1/2 wide, the width of the fins.
3. At the top of the cooler you could design a special 120mm or 140mm fan with a custom designed triangular case, continuing the traingle theme. It would hopefully provide sufficient updraft and essentially serving as an attic fan for a triangular tower, which would in my opinion be an extremely efficient way to transfer heat.
4. The fan should be easy to remove and replace if needed. I imagine having the fan being mounted using retainer clips that were sturdy metal, but thin. Thin enough to slip down in between the fins on top of the cooler, but having the ability to clamp down around the copper pipes in several locations. Imagine something like a necklace clasp, but something that was designed to be self-clasping upon slipping it over the copper pipes. And you could perhaps easily unclasp it with a thin screwdriver if needed.
I hope this makes sense. If you are interested and need more of a visual representation, I could try to whip something up, but I promise it'll be ugly.
1. 5 pipes directly touching which then rise off of the chip on both sides of the chip by around 1/2". Then these pipes will NOT rise vertically where they are typically capped. They will instead snake around in a sort of horizontal but gradually upward spiralling form, eventually being capped towards the top of the cooler, with the pipes facing horizontally and parallel to the chip at this point.
2. Fins will run perpindicular and vertical to the chip, rather than horizontal, approximately being 1/2" wide on each side.
3. The entire cooler will have a triangular shape. If you looked at it from the top down you would see an equilateral triangle with three sides of vertical fins encasing pipes, and each side would be around 1/2 wide, the width of the fins.
3. At the top of the cooler you could design a special 120mm or 140mm fan with a custom designed triangular case, continuing the traingle theme. It would hopefully provide sufficient updraft and essentially serving as an attic fan for a triangular tower, which would in my opinion be an extremely efficient way to transfer heat.
4. The fan should be easy to remove and replace if needed. I imagine having the fan being mounted using retainer clips that were sturdy metal, but thin. Thin enough to slip down in between the fins on top of the cooler, but having the ability to clamp down around the copper pipes in several locations. Imagine something like a necklace clasp, but something that was designed to be self-clasping upon slipping it over the copper pipes. And you could perhaps easily unclasp it with a thin screwdriver if needed.
I hope this makes sense. If you are interested and need more of a visual representation, I could try to whip something up, but I promise it'll be ugly.
nukemaster
Titan
- Nov 23, 2004
- 19,623
- 6
- 74,965
[citation][nom]ohim[/nom]http://img844.imageshack.us/img844/6821/coolerh.jpgMy ideea. I implemented it in my PC using cardboard channeling pipes ^^[/citation]
well, since the fans look like nukes. i like it.
I have done similar to channel air.
well, since the fans look like nukes. i like it.
I have done similar to channel air.
I'm sure this might have occurred to many people already, but here's my idea. Incorporate a simple design that's based on the rugae that lines our stomach. That's probably the most effective way (in nature) into creating more surface area. Another idea is the "ground meat" concept, which is known for having a ridiculous amount of surface area. Though, the rugae design seems more feasible with our current technology.
quantumrand
Distinguished
- Feb 12, 2009
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While it might take a lot of development just to end up as a dead end, it would be interesting to see a fanless heatsink that uses either ionizes the air or uses the thermal properties of air to create air flow.
Another interesting "fanless" concept would be to take something like Dyson's Bladeless fan, using airfoils to force air over the heatsink.
Another interesting "fanless" concept would be to take something like Dyson's Bladeless fan, using airfoils to force air over the heatsink.
My idea is for a completely passive and silent system. Start off with a tower case made of solid aluminum, which will ultimately act as a giant heat sink. The sides of this case have many equally spaced holes drilled in to:
1. Increase surface area
2. Add some style
3. Allow users to see the components inside
4. Save on materials cost
5. Possibly allow for some minimal, natural airflow.
You could vary the hole pattern or add some solid regions to create logos or make a design statement.
Copper (or Aluminum) wire bundles are then attached to roughly 14 points on this case (4 on each of the large sides and 2 on the front, top, and back, as equally spaced as possible). I would prefer that the wires be welded on, but other attachment methods may be easier and bring costs down. The other end of each of these wire bundles has a special clip (or screw) that can be attached to various heat sink "terminals" made by Zalman.
For example, Zalman could offer a socket 1366 heat sink with attachments for nine wire bundles. One end of the spreader would attach to the CPU with thermal paste as usual and on the other end you'd attach nine of the wire bundles. Similar heat sink terminals could be made for GPUs, hard drives, and other components.
Because the wires are a little bit flexible they allow you to provide direct connections for heat to flow between components like the CPU and spaced-out points on the aluminum case, even though the exact placement of CPUs will vary a little bit between systems based on the motherboard and other options. All the wire bundles will have their own terminal connections near the end so you can attach any unused wires and create a "web" look in the case.
The case will likely get warm, but it is extremely large compared to normal heat sinks and because the wire connections are spread out it shouldn't be too bad. It certainly wouldn't be anything like the bottom of a laptop.
Target market for a case like this would be home theater PC, design studios, or the type of person who wants style and absolute silence. I doubt it would set overclocking records for hardcore gamers, but it would keep the heat well in check, look good, and be perfectly quiet.
I'd certainly buy one.
1. Increase surface area
2. Add some style
3. Allow users to see the components inside
4. Save on materials cost
5. Possibly allow for some minimal, natural airflow.
You could vary the hole pattern or add some solid regions to create logos or make a design statement.
Copper (or Aluminum) wire bundles are then attached to roughly 14 points on this case (4 on each of the large sides and 2 on the front, top, and back, as equally spaced as possible). I would prefer that the wires be welded on, but other attachment methods may be easier and bring costs down. The other end of each of these wire bundles has a special clip (or screw) that can be attached to various heat sink "terminals" made by Zalman.
For example, Zalman could offer a socket 1366 heat sink with attachments for nine wire bundles. One end of the spreader would attach to the CPU with thermal paste as usual and on the other end you'd attach nine of the wire bundles. Similar heat sink terminals could be made for GPUs, hard drives, and other components.
Because the wires are a little bit flexible they allow you to provide direct connections for heat to flow between components like the CPU and spaced-out points on the aluminum case, even though the exact placement of CPUs will vary a little bit between systems based on the motherboard and other options. All the wire bundles will have their own terminal connections near the end so you can attach any unused wires and create a "web" look in the case.
The case will likely get warm, but it is extremely large compared to normal heat sinks and because the wire connections are spread out it shouldn't be too bad. It certainly wouldn't be anything like the bottom of a laptop.
Target market for a case like this would be home theater PC, design studios, or the type of person who wants style and absolute silence. I doubt it would set overclocking records for hardcore gamers, but it would keep the heat well in check, look good, and be perfectly quiet.
I'd certainly buy one.
quantumrand
Distinguished
- Feb 12, 2009
- 179
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Actually, a Peltier engine would be really interesting, and with today's ridiculously over-powered PSU, there's plenty of extra amperage for some extreme cooling. I don't really see with working as a fanless solution though, considering there would be quite a bit of waste heat that would need to be expelled from the system. Still, with the proper setup, it could potentially outperform a watercooled system.
Speaking of water cooling, a Peltier engine would work extremely well in that situation as well. It could be attached to the radiator, which in most cases already has a proper exhaust setup. The only issue I see with this is that the water would take a while to cool down, so optimum cooling wouldn't be achieved until the system had been running for some time.
Speaking of water cooling, a Peltier engine would work extremely well in that situation as well. It could be attached to the radiator, which in most cases already has a proper exhaust setup. The only issue I see with this is that the water would take a while to cool down, so optimum cooling wouldn't be achieved until the system had been running for some time.
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