ahaywood :
The TIM that Intel is using for the IHS is making it difficult to cool the processor.
The TIM is not the real problem from what I have read.
Someone who de-lidded his Haswell measured the substrate-to-top-of-die and substrate-to-IHS-top heights, subtracted the IHS thickness from the difference and concluded that there is a ~60 micron gap between the IHS and CPU die - the IHS is not making physical contact with the die at all. By replacing the TIM with known high-quality stuff and replicating the gap using paper shims to achieve the same substrate-to-IHS thickness, he found out that Intel's TIM appears to be just as good as enthusiast stuff since the enthusiast stuff actually performed a few degrees worse than Intel's TIM. Removing the gap (shims) is what produced a 20-30C drop in OC temperatures.
Based on that, it seems Intel's TIM would be perfectly fine were it not for the surprisingly large gap between IHS and die.