[citation][nom]wolfram23[/nom]Going to be sick! And only $750! Lol!300W isn't bad, I'm probably using more than that between my two OCed 5850s... so, dropping in a single much faster card would be a win for sure!Just gotta wait for the hydro version...[/citation]
that is europe price, they have retardedly high taxes on things like this, and i believe they are factored in, im assuming those numbers are 100-150$ less for the north american market.
[citation][nom]jtt283[/nom]It shouldn't take the wattage of a hair dryer to play games, even on excellent settings. I want to see 6970 performance on the power requirements of a 6850; 6850 performance on the requirements of a 6670. THOSE improvements would be nice. The card I have can play all my games maxed, so it isn't GPU muscle I need.[/citation]
well... look at this this way... the wiiu will be coming out with hardware tessellation, and it will be used, currently cards take a 30-40% hit when using even a small amount of tessellation... there may be a great need for a card like this in the coming years, especialy if the wiiu gets lead platform.
[citation][nom]megamanx00[/nom]All the reasonable voices that wanted to keep the die size down were fired -_-. Well, I suppose as a halo product it doesn't even need to turn much of a profit, but we'll see how the volume parts do.[/citation]
the die size should be as large as what its replacing, that way cost is about the same, but its power is far higher... i dont want a die shrink and it taking less power, but preforming the same, and costing less out of the highest end cards, i want the process shrink that the die to stay the same size, and blow the crap out of anything else currently out there.
[citation][nom]robochump[/nom]7000 series needs to be at least 20% faster than 6000 to be a winner. Also being more power efficient is a plus but comparable would be nice.[/citation]
rumors are putting the high end card at the same speed as dual gpu solutions.