i already make that. and work like charm. drooped over 4ºc on 3770k can run 4.6 all time. my ambient temps its like 38ºc 40ºc . 4ºc on backside of mb ITS A GREAT DOOR TO SOME OVERCLOCK! " Pins OF CPU are GOLD and The Pins of the SOCKET are Gold with cooper". best metal to transfer heat.
AI Technology has some 'pads' that are much thinner at 3 mils and are 1.5" x 1.5"
Their Blurb on the 'Cool Silver Pad"
"COOL-SILVER PAD™ Thermal Pad has a measurable performance advantage in dropping the semiconductor junction temperature with the same heat-sink and CPU. It contains more than 90% silver by weight, 0% silicone, and is RoHS compliant. The thermal resistance is lower than the known “industry standard” of <0.0045°C-in2/Watt @ 0.001 inch interface layer thickness. Side by side comparison with the best known thermal interface materials for CPU applications demonstrated the superior performance of COOL-SILVER PAD™."
Non Conductive Too.
"COOL-SILVER PAD™ TIM, unlike some of the earlier generations of silver thermal interface materials, will not separate, run, migrate, or bleed. Even though the thermal conductivity comes from the highly packed micronized pure silver particulate, it is not electrically conductive."
They also have larger pads and thicker gap filler pads.
insulate: to cover, line, or separate with a material that prevents or reduces the passage, transfer, or leakage of heat, electricity, or sound:
The purpose of a thermal pad is to move or transfer heat from one surface to another. Example, on a GFX card w/ a backplate there is an air space between the VRM, memory whatever and the "dead air" space serves as an insulator between chip and the metal surface. A thermal pad of proper thickness will move the heat from the chop to the metal surface because it has more thermal conductivity than the dead air space. The metal backplate is then able to absorb the heat which it can then transfer to the air within the case. Because the air within the case, hopefully, id not "dead air" but moving air, the heat is taken away and exhausted from the case.
A pad has to be sandwiched to be effective. It does not help applying a pad in top of say a MoBo heat sink exposed to air, in this instance it actually hinders heat transfer.
Fujipoly pads have been the enthusiast choice for many years.
I suppose a thermal pad, by definition, isn't technically "insulation," then. I'm sure it does dampen sound and non-electrical heat to some manner and lower humidity or moisture. That being said, it wouldn't be a bad thing behind a motherboard, it's not like you want hot air sitting underneath your components not circulating.