Its rather impressive how much they managed to shove in there, im curious if its going to have overheating issues with that much shoved it and not much space for airflow, only time will tell.
The packaging of the Cell and RSX is still the same but it would be interesting to compare them to their previous versions with the heat spreader removed. At least that heatsink is a heck of alot smaller now .
The chips are small, you're looking at a large heat-spreader.
Even on the inside, it has a fancy SONY logo on the cooling duct
This is a very elegant design... over the original PS3. Far simpler than the 360.
Curious... how easy it is to replace/upgrade the Hard Drive. With the PS3-ORG being an access panel. The big photos of PS3-Slim shows what LOOKS like an access panel for the HD (and its in the right place compared to the internal photos) - on this article, it doesn't seem to work that way. There is a screw that holds the HD cage in place, preventing an easy access panel from working. But that screw could be optional.
Really impressive to see so little stuff on the PCB... really interesting. Now, I understand why Sony made the new design and it is clear why they are saving a lot of money.
[citation][nom]redgarl[/nom]Really impressive to see so little stuff on the PCB... really interesting. Now, I understand why Sony made the new design and it is clear why they are saving a lot of money.[/citation]
Easy access hdd panel on the front vs fat PS3 with is on the back. Always had user replaceable hdd unlike the mess of an upgrade system MS has.
[citation][nom]redgarl[/nom]Really impressive to see so little stuff on the PCB... really interesting. Now, I understand why Sony made the new design and it is clear why they are saving a lot of money.[/citation]
[citation][nom]Belardo[/nom]The chips are small, you're looking at a large heat-spreader.Even on the inside, it has a fancy SONY logo on the cooling duct This is a very elegant design... over the original PS3. Far simpler than the 360. Curious... how easy it is to replace/upgrade the Hard Drive. With the PS3-ORG being an access panel. The big photos of PS3-Slim shows what LOOKS like an access panel for the HD (and its in the right place compared to the internal photos) - on this article, it doesn't seem to work that way. There is a screw that holds the HD cage in place, preventing an easy access panel from working. But that screw could be optional.[/citation]
[citation][nom]fonzy[/nom]I thought the Cell processor would much smaller, especially the 45nm.[/citation]
its called an Integrated Heat Spreader, the actual silicon could be smaller, but it's covered, unless you pry off that IHS you cannot tell the difference (they would most likely reuse the IHS from the non slim, its not a big deal having too much metal protection)
The heat spreader was introduced in the x86 cpus with the Intel p4.
The metal plate "solved" several issues with ruined cpu's where heatsinks ruined the cpu. Another similar move was made by Intel when removing the pins from processors in the socket 775 series; less manufacturer risk; but i digress.